Semiconductor device and assortment of semiconductor devices with electrically conductive ribbon configurations

An assortment of semiconductor devices, comprising:

• a first semiconductor device and a second semiconductor device;
• wherein each of the first and second semiconductor devices comprises:
• a mounting substrate comprising at least one die pad as well as a first electrically conductive pad and a second electrically conductive pad with a strip of insulating material between the first and second electrically conductive pads, wherein the strip of insulating material extends in a longitudinal direction with the first electrically conductive pad and the second electrically conductive pad lying on opposite sides of the strip of insulating material and being mutually electrically insulated by the strip of insulating material;
• and
• a semiconductor die arranged on said at least one die pad in register with the strip of insulating material;
• wherein the first semiconductor device comprises:
• a single electrically conductive ribbon electrically coupling the semiconductor die arranged on said at least one die pad with the first electrically conductive pad and the second electrically conductive pad, the single electrically conductive ribbon extending in said longitudinal direction in register with the strip of insulating material, wherein the single electrically conductive ribbon electrically contacts the first electrically conductive pad and the second electrically conductive pad that lie on opposite sides of the strip of insulating material and provides a current flow path from the semiconductor die arranged on said at least one die pad towards the first and second electrically conductive pads;
• and
• wherein the second semiconductor device comprises:
• first and second electrically conductive ribbons electrically coupling the semiconductor die arranged on said at least one die pad with the first electrically conductive pad and the second electrically conductive pad, the first and second electrically conductive ribbons extending in said longitudinal direction on opposite sides of the respective strip of insulating material, wherein the first electrically conductive ribbon provides a first current conduction path from the semiconductor die arranged on said at least one die pad towards the first electrically conductive pad, and the second electrically conductive ribbon provides a second current conduction path from the semiconductor die arranged on said at least one die pad towards the second electrically conductive pad, the first current conduction path being distinct from the second current conduction path.

A semiconductor device, comprising:

• a mounting substrate comprising at least one die pad as well as a first electrically conductive pad and a second electrically conductive pad with a strip of insulating material between the first and second electrically conductive pads, wherein the strip of insulating material extends in a longitudinal direction with the first electrically conductive pad and the second electrically conductive pad lying on opposite sides of the strip of insulating material and being mutually electrically insulated by the strip of insulating material;
• a semiconductor die arranged on said at least one die pad in register with the strip of insulating material;
• and
• a single electrically conductive ribbon electrically coupling the semiconductor die arranged on said at least one die pad with the first electrically conductive pad and the second electrically conductive pad, the single electrically conductive ribbon extending in said longitudinal direction in register with the strip of insulating material, wherein the single electrically conductive ribbon electrically contacts the first electrically conductive pad and the second electrically conductive pad that lie on opposite sides of the strip of insulating material and provides a current flow path from the semiconductor die arranged on said at least one die pad towards the first and second electrically conductive pads;
• wherein a distal end of the single electrically conductive ribbon extends as a bridge over and in contact with the strip of insulating material between the first electrically conductive pad and the second electrically conductive pad.

A semiconductor device, comprising:

• a mounting substrate comprising at least one die pad as well as a first electrically conductive pad and a second electrically conductive pad with a strip of insulating material between the first and second electrically conductive pads, wherein the strip of insulating material extends in a longitudinal direction with the first electrically conductive pad and the second electrically conductive pad lying on opposite sides of the strip of insulating material and being mutually electrically insulated by the strip of insulating material;
• a semiconductor die arranged on said at least one die pad in register with the strip of insulating material;
• and
• a single electrically conductive ribbon having a first end electrically coupled to the semiconductor die arranged on said at least one die pad and having a second end with a wedge bond connection to both the first electrically conductive pad and the second electrically conductive pad, the single electrically conductive ribbon extending in said longitudinal direction in register with the strip of insulating material, wherein the second end of the single electrically conductive ribbon bridges over and contacts the strip of insulating material lying between the first electrically conductive pad and the second electrically conductive pad, said single electrically conductive ribbon providing a current flow path from the semiconductor die arranged on said at least one die pad towards the first and second electrically conductive pads.