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US 12,444,664 B2Granted
Loading frame for high I/O count packaged semiconductor chip
AssigneeSK Hynix NAND Product Solutions Corp.
InventorsJeffory L. Smalley, Mohanraj Prabhugoud, Steven A. Klein, Mengqi Liu
Life of this patent
Estimating the term…
Abstract
An apparatus is described. The apparatus includes a loading frame for mounting a packaged semiconductor chip and a heat sink for the packaged semiconductor chip to a socket. The loading frame is comprised of metal. The loading frame has at least one frame leg where the metal is folded to re-enforce a strength of the frame leg.
Claims20
An apparatus, comprising:
- a packaged semiconductor chip;
- a socket;
- a heat sink for the packaged semiconductor chip;
- and
- a loading frame for mounting the packaged semiconductor chip and the heat sink to the socket, wherein the loading frame comprises a loading frame base coupled to at least one frame leg, and wherein the at least one frame leg comprises metal folded inward on an edge of the at least one frame leg to form a C shaped cross section.
2 more elements
An apparatus, comprising:
- an electronic system, the electronic system comprising i) through iv) below:
- i) a printed circuit board, the printed circuit board comprising a socket;
- ii) a packaged semiconductor chip plugged into the socket;
- iii) a heat sink on the packaged semiconductor chip;
- and,
- iv) a loading frame coupled between the heat sink and the printed circuit board, wherein the loading frame comprises a loading frame base coupled to at least one frame leg, and wherein the at least one frame leg comprises metal folded inward on an edge of the at least one frame leg to form a C shaped cross section.
3 more elements
An apparatus, comprising:
- a data center, the data center comprising multiple racks, the multiple racks having multiple electronic systems that are communicatively coupled by way of at least one optical channel, wherein, an electronic system of the multiple electronic systems comprises i) through iv) below:
- i) a printed circuit board, the printed circuit board comprising a socket;
- ii) a packaged semiconductor chip plugged into the socket;
- iii) a heat sink on the packaged semiconductor chip;
- and,
- iv) a loading frame coupled between the heat sink and the printed circuit board, wherein the loading frame comprises a loading frame base coupled to at least one frame leg, and wherein the at least one frame leg comprises metal folded inward on an edge of the at least one frame leg to form a C shaped cross section.
3 more elements
Dependencies are inferred from the claim text.