Semiconductor device

A semiconductor device comprising:

• a laminate including
• a semiconductor element including a first electrode in a first surface thereof and a second electrode in a second surface thereof, the first and second surfaces facing away from each other;
• an insulating substrate on the first surface of the semiconductor element, the insulating substrate having a through hole exposing the first electrode;
• an interconnect on a surface of the insulating substrate facing away from the semiconductor element, the interconnect being electrically connected to the first electrode through the through hole, the interconnect having a depression depressed toward the semiconductor element in a surface thereof facing away from the semiconductor element;
• and
• an interconnect member on the second surface of the semiconductor element, the interconnect member being electrically connected to the second electrode;
• a first terminal and a second terminal that are elastic and hold the laminate therebetween in a direction of lamination with elasticity, the first terminal including a bulge that engages with the depression to contact the surface of the interconnect, the second terminal contacting the interconnect member;
• and
• a fixing member fixing the first terminal and the second terminal while electrically isolating the first terminal and the second terminal from each other.