Resin encapsulated semiconductor device having a reduced thickness and improved reliability

A lead frame comprising:

• an outer frame surrounding a region in which a semiconductor chip is mounted;
• a die pad formed in the region surrounded by the outer frame;
• support leads for supporting the die pad by connecting the die pad to the outer frame;
• and
• signal-connecting leads connected to the outer frame,
• wherein the die pad is located below the outer frame, the support leads are provided between the signal-connecting leads and the die pad, and part of each said support lead is bent to function as a spring.

A resin-molded semiconductor device comprising:

• a semiconductor chip having electrode pads;
• a die pad for supporting the semiconductor chip thereon;
• support leads for supporting the die pad;
• signal-connecting leads;
• connecting members for electrically connecting the electrode pads of the semiconductor chip to the signal-connecting leads;
• and
• a resin encapsulant for encapsulating the die pad, the semiconductor chip, the signal-connecting leads and the connecting members,
• wherein respective lower parts of the die pad and the signal-connecting leads are at least partially not covered with the resin encapsulant but exposed, and
• wherein each said support lead extends from an associated corner of the die pad to reach a side face of the resin encapsulant and is partially bent to function as a spring.

A resin-molded semiconductor device comprising:

• a semiconductor chip having electrode pads;
• a die pad for supporting the semiconductor chip thereon;
• support leads for supporting the die pad;
• signal-connecting leads;
• connecting members for electrically connecting the electrode pads of the semiconductor chip to the signal-connecting leads;
• and
• a resin encapsulant for encapsulating the die pad, the semiconductor chip, the signal-connecting leads and the connecting members,
• wherein respective lower parts of the die pad and the signal-connecting leads are at least partially not covered with the resin encapsulant but exposed, the support leads are provided between the die pad and the signal-connecting leads, and each said support lead is partially bent to function as a spring.