Lead-wire frame structure for packaging and sensor package structure

Abstract

A lead-wire frame structure for packaging and a sensor package structure, which are applied to the field of sensor preparation. The lead-wire frame structure comprises: a bonding-pad component and a plurality of pin components, wherein the bonding-pad component is provided with an inward recess in a plane direction of a coplane which is formed by the bonding-pad component and the plurality of pin components. In the plane direction, arc-shaped packaging interfaces for offsetting stresses are formed in an aligned manner on an inner contour of the recess and an outer contour of the recess in the bonding-pad component. In the present application, the bonding-pad component is provided with the inward recess in the plane direction, and the aligned packaging interfaces of the inner contour of the recess and the outer contour of the recess arc designed to be of arc-shaped structures, which can offset internal and external stresses.

Dependencies are inferred from the claim text.