Electronic device with die pads and leads

An electronic device comprising:

• an electronic component provided with a first electrode pad;
• a die pad including an obverse surface perpendicular to a first direction, the electronic component being mounted on the obverse surface;
• a first lead spaced apart from the die pad in a second direction perpendicular to the first direction;
• a second lead separated from the die pad and the first lead;
• and
• a first connection member electrically connecting the first electrode pad and the first lead to each other,
• wherein the first lead and the second lead are disposed on a same side of the die pad in the second direction,
• as viewed in the first direction, the first lead includes a first extended portion extending in a third direction perpendicular to the first direction and the second direction, the first extended portion including a first edge and a second edge that are spaced apart from each other in the second direction, the first edge being closer to the die pad than is the second edge in the second direction,
• the first connection member is bonded to the first lead,
• as viewed in the first direction, the second lead includes a third edge and a fourth edge that are spaced apart from each other in the second direction, the third edge being greater in length than the fourth edge in the third direction, and
• the first edge of the first extended portion is placed closer to the die pad than is the third edge of the second lead in the second direction.