Tape under frame for conventional-type IC package assembly
AssigneeMicron Technology, Inc.
InventorsDavid J. Corisis, Larry D. Kinsman, Jerry M. Brooks
Life of this patent
Estimating the term…
Abstract
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.
Claims60
A lead frame connected to a semiconductor device, the lead frame comprising:
- a lead frame including a plurality of lead fingers, the plurality of lead fingers each having a proximal end inwardly extending to define a semiconductor device opening in the lead frame, the lead frame having no die paddle for supporting said semiconductor device;
- and
- a section of tape having a periphery and a central portion, the section of tape attached to at least a portion of the proximate ends of the plurality of lead fingers of the lead frame, the section of tape having at least one slot therein extending across a portion thereof.
A lead frame for use with a semiconductor device, the lead frame comprising:
- a lead frame including a plurality of lead fingers, the plurality of lead fingers each having a proximal end inwardly extending to define an opening in the lead frame for said semiconductor device, the lead frame having no die paddle for the supporting of said semiconductor device;
- and
- a section of tape having a periphery, a central portion, and at least one slot formed therein, the section of tape attached to at least a portion of the proximate ends of the plurality of lead fingers of the lead frame.
An assembly of a semiconductor integrated circuit device and a lead frame, said assembly comprising:
- a conventional-type lead frame including a periphery, central portion, a center axis and a plurality of lead fingers, the plurality of lead fingers each having a proximal end inwardly extending to define a semiconductor integrated circuit device opening in the conventional-type lead frame;
- and
- a section of tape having a periphery and a central portion, the section of tape attached to at least a portion of the proximate ends of the plurality of lead fingers, the section of tape having at least two slots therein.
An assembly of a semiconductor integrated circuit device and a lead frame, said assembly comprising:
- a conventional-type lead frame including a periphery, central portion, a center axis and a plurality of lead fingers, the plurality of lead fingers each having an end inwardly extending to define a semiconductor integrated circuit device opening in the conventional-type lead frame;
- and
- a section of tape having at least one slot formed therethrough, the section of tape attached proximate the periphery of the section of tape to at least a portion of the plurality of lead fingers at the ends thereof.
An assembly of a semiconductor integrated circuit device and a lead frame, said assembly comprising:
- a paddleless, conventional-type lead frame including a plurality of lead fingers and having an opening therein;
- and
- a plurality of tape segments, each tape segment of the plurality of tape segments having a periphery, each tape segment of the plurality of tape segments attached to a portion of the plurality of lead fingers, the plurality of tape segments being spaced apart to define an opening between the plurality of tape segments, wherein at least one of the plurality of tape segments has an aperture formed therein.
Dependencies are inferred from the claim text.