H10W 70/438
Of side rails
Official title: {of side rails, e.g. having holes}
H10W70/438 (Of side rails) appears on 162 US grants and 200 published applications in this corpus.
Search patents in H10W- Granted patents
- 162
- Published applications
- 200
- Assignees
- 96
- Inventors
- 408
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 2 |
| 2002 | 2 | 3 |
| 2003 | 4 | 5 |
| 2004 | 2 | 3 |
| 2005 | 5 | 8 |
| 2006 | 4 | 5 |
| 2007 | 4 | 6 |
| 2008 | 4 | 5 |
| 2009 | 2 | 9 |
| 2010 | 2 | 2 |
| 2011 | 3 | 3 |
| 2012 | 0 | 3 |
| 2013 | 7 | 5 |
| 2014 | 3 | 4 |
| 2015 | 6 | 7 |
| 2016 | 4 | 11 |
| 2017 | 8 | 15 |
| 2018 | 12 | 11 |
| 2019 | 12 | 10 |
| 2020 | 8 | 10 |
| 2021 | 12 | 11 |
| 2022 | 6 | 12 |
| 2023 | 7 | 14 |
| 2024 | 10 | 13 |
| 2025 | 9 | 13 |
| 2026 | 5 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing semiconductor apparatus and semiconductor apparatus8 Sep 2026US 12,733,511 B2Rohm Co., Ltd.
- IGBT module, motor controller, and vehicle11 Aug 2026US 12,707,662 B2BYD Company Limited
- Semiconductor device23 Jun 2026US 12,666,975 B2Rohm Co., Ltd.
- Small outline transistor with thermal flat lead26 May 2026US 12,642,106 B2Texas Instruments Incorporated
- Semiconductor device with resin bleed control structure and method therefor13 Jan 2026US 12,525,511 B2NXP USA, Inc.
- Small outline transistor with thermal flat lead24 Sep 2026US 2026/0293707 A1
- Semiconductor device17 Sep 2026US 2026/0282947 A1Rohm Co., Ltd.
- Semiconductor devices and methods of manufacturing semiconductor devices27 Aug 2026US 2026/0255987 A1Amkor Technology Singapore Holding Pte.Ltd.
- Encapsulated semiconductor package and a method of manufacturing such encapsulated semiconductor package6 Aug 2026US 2026/0231786 A1Nexperia B. V.
- Terminal structure with depression region below dielectric wall and semiconductor package having the same14 May 2026US 2026/0136950 A1Bridge Semiconductor Corporation
Most cited
By later US patents
- Method, apparatus and lead frame for assembling leads with terminals on a substrate220US 4,054,238 AWestern Electric Company, Inc. · 1977
- Multi-part lead frame with dissimilar materials and method of manufacturing173US 6,072,228 AMicron Technology, Inc. · 2000
- Carrier tapes for semiconductor devices153US 4,234,666 AWestern Electric Company, Inc. · 1980
- Multi-part lead frame with dissimilar materials and method of manufacturing138US 6,140,154 AMicron Technology, Inc. · 2000
- Method for making a pre-testable semiconductor die package105US 4,801,561 ANational Semiconductor Corporation · 1989