Semiconductor device

A semiconductor device comprising:

• a conductor having obverse surfaces and reverse surfaces facing away from each other in a thickness direction;
• a semiconductor element having a body layer and a plurality of electrodes, the plurality of electrodes projecting toward the obverse surfaces from a side of the body layer that opposes the obverse surfaces in the thickness direction;
• and
• a bonding layer bonding the obverse surfaces and the plurality of electrodes,
• wherein each of the plurality of electrodes has a base portion in contact with the body layer and a columnar portion projecting from the base portion and in contact with the bonding layer,
• the plurality of electrodes include a first electrode and a second electrode, the second electrode being located closer to a periphery of the body layer than is the first electrode as viewed in the thickness direction,
• the columnar portion of the second electrode has a larger area than the columnar portion of the first electrode as viewed in the thickness direction,
• the columnar portion of each of the plurality of electrodes has an end surface opposing a relevant one of the obverse surfaces, and a side surface connected to the end surface and facing in a direction orthogonal to the thickness direction,
• the columnar portion of each of the plurality of electrodes is formed with a recess that is recessed from the end surface toward the body layer,
• as viewed in the thickness direction, an entirety of the recess is spaced apart from the side surface, and a center of the columnar portion overlaps with the recess,
• the bonding layer is in contact with the end surface and the side surface, and
• the columnar portion of the second electrode has a curved surface forming a boundary between the end surface and the side surface and bulging toward an outside of the columnar portion.