Small outline transistor with thermal flat lead
AssigneeTexas Instruments Incorporated
InventorsHau Nguyen, Ashok Prabhu, Kurt Sincerbox
Life of this patent
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Abstract
An electronic device includes a die attach pad, a semiconductor die, a lead, a package structure, and tie bars, where the die attach pad has opposite first and second sides, the semiconductor die is attached to the second side of the die attach pad, the lead has a first portion connected to a circuit of the semiconductor die by a bond wire, the package structure exposes a portion of the first side of the die attach pad and the second portion of the lead. Four tie bars extend outward from the die attach pad and the tie bars have respective ends exposed outside the package structure.
Claims25
An electronic device, comprising:
- a die attach pad having opposite first and second sides;
- a semiconductor die attached to the second side of the die attach pad;
- a lead having a first portion and a second portion, the first portion of the lead connected to a circuit of the semiconductor die by a bond wire;
- a package structure having opposite first and second sides, the package structure enclosing the bond wire, a portion of the semiconductor die, and a portion of the second side of the die attach pad, and the first side of the package structure exposing a portion of the first side of the die attach pad, and the second portion of the lead;
- and
- first, second, third, and fourth tie bars extending outward from the die attach pad and away from a plane of the first side of the die attach pad, the tie bars having respective ends exposed outside the package structure.
An electronic device, comprising:
- a die attach pad having opposite first and second sides;
- a semiconductor die attached to the second side of the die attach pad;
- a lead having a first portion and a second portion, the first portion of the lead connected to a circuit of the semiconductor die by a bond wire;
- a package structure having opposite first and second sides, the package structure enclosing the bond wire, a portion of the semiconductor die, and a portion of the second side of the die attach pad, and the first side of the package structure exposing a portion of the first side of the die attach pad, and the second portion of the lead;
- and
- first, second, third, and fourth tie bars extending outward from the die attach pad, wherein the tie bars extend away from a plane of the first side of the die attach pad, the tie bars having respective ends exposed outside the package structure and the ends of the respective tie bars are spaced apart from the plane of the first side of the die attach pad.
A lead frame panel array, comprising:
- unit regions arranged in rows along a first direction and columns along an orthogonal second direction, each unit region including a die attach pad with opposite ends, two tie bars connected to each end of the die attach pad along a column direction, and a lead;
- each die attach pad having opposite first and second sides;
- the two tie bars of neighboring unit regions joining together only the two neighboring unit regions;
- and
- each lead having a first portion and a second portion, the first portion spaced apart from a plane of the first side of the die attach pad, and the second portion having a bottom along the plane of the first side of the die attach pad.
An electronic device, comprising:
- a die attach pad having opposite first and second sides;
- a semiconductor die attached to the second side of the die attach pad;
- a lead having a first portion and a second portion, the first portion of the lead connected to a circuit of the semiconductor die by a bond wire;
- a package structure having opposite first and second sides, the package structure enclosing the bond wire, a portion of the semiconductor die, and a portion of the second side of the die attach pad, and the first side of the package structure exposing a portion of the first side of the die attach pad, and the second portion of the lead;
- and
- tie bars extending outward from the die attach pad and away from a plane of the first side of the die attach pad, the tie bars having respective ends exposed outside the package structure.
Dependencies are inferred from the claim text.