Multi-part lead frame with dissimilar materials and method of manufacturing
AssigneeMicron Technology, Inc.
InventorsS. Derek Hinkle, Jerry M. Brooks, David J. Corisis
Life of this patent
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Abstract
A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.
Claims15
A method of manufacturing a semiconductor device assembly having a semiconductor device therein, said semiconductor device having an active surface having at least one bond pad thereon, said method comprising the steps of:
- forming a first lead frame of a first material, said first lead frame including a die paddle of said first material;
- attaching said semiconductor device to said die paddle;
- forming a second lead frame of a second material, said second lead frame including carriers and at least one inner lead portion;
- and
- securing a portion of said die paddle to a portion of said second lead frame.
A method of manufacturing a semiconductor device assembly having a semiconductor device therein, said semiconductor device having an active surface having a bond pad thereon, said method comprising the steps of:
- forming a first lead frame including a die paddle, first carriers, each of said first carriers having at least one first alignment hole therein, at least one tie bar, and at least one attachment tab extending from said tie bar, said tie bar interconnecting said die paddle and a carrier of said first carriers;
- attaching said semiconductor device to said die paddle;
- forming a second lead frame including second carriers, each of said second carriers having an attachment tab receiving portion affixed thereto and at least one second alignment hole therein, and a plurality of leads, at least one lead of said plurality of leads having an inner lead portion and an outer lead portion;
- aligning said at least one first alignment hole of a carrier of said first carriers of said first lead frame and said at least one second alignment hole of a carrier of said second carriers of said second lead frame;
- securing said attachment tabs of said first lead frame to said attachment tab receiving portions of said second lead frame;
- and
- cutting said tie bar at a point between said attachment tabs and said first carriers.
Dependencies are inferred from the claim text.