H10W 70/424
Cross-sectional shapes
Official title: {Cross-sectional shapes (H10W70/481 takes precedence)}
H10W70/424 (Cross-sectional shapes) appears on 3,881 US grants and 4,483 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,881
- Published applications
- 4,483
- Assignees
- 686
- Inventors
- 5,471
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 5 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 7 | 0 |
| 1988 | 11 | 0 |
| 1989 | 11 | 0 |
| 1990 | 9 | 0 |
| 1991 | 22 | 0 |
| 1992 | 14 | 0 |
| 1993 | 17 | 0 |
| 1994 | 30 | 0 |
| 1995 | 42 | 0 |
| 1996 | 29 | 0 |
| 1997 | 28 | 0 |
| 1998 | 36 | 0 |
| 1999 | 35 | 0 |
| 2000 | 49 | 0 |
| 2001 | 47 | 21 |
| 2002 | 51 | 76 |
| 2003 | 56 | 74 |
| 2004 | 72 | 82 |
| 2005 | 75 | 109 |
| 2006 | 91 | 92 |
| 2007 | 74 | 125 |
| 2008 | 70 | 170 |
| 2009 | 89 | 249 |
| 2010 | 117 | 170 |
| 2011 | 156 | 181 |
| 2012 | 164 | 135 |
| 2013 | 173 | 142 |
| 2014 | 157 | 168 |
| 2015 | 191 | 220 |
| 2016 | 198 | 238 |
| 2017 | 224 | 239 |
| 2018 | 208 | 213 |
| 2019 | 192 | 210 |
| 2020 | 188 | 242 |
| 2021 | 185 | 228 |
| 2022 | 164 | 206 |
| 2023 | 156 | 235 |
| 2024 | 158 | 246 |
| 2025 | 136 | 262 |
| 2026 | 117 | 150 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Lead frame with a tie bar having branch part29 Sep 2026US 12,751,294 B2Diodes Incorporated
- Semiconductor device29 Sep 2026US 12,751,295 B2Rohm Co., Ltd.
- Semiconductor device29 Sep 2026US 12,751,296 B2Power Master Semiconductor Co., Ltd.
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
- Quad flat no-lead (qfn) manufacturing process1 Oct 2026US 2026/0305379 A1
- Double sided multi chip for leaded package1 Oct 2026US 2026/0305380 A1
Most cited
By later US patents
- Analyte monitoring device and methods of use2,634US 6,175,752 B1TheraSense, Inc. · 2001
- Analyte monitoring device and methods of use2,053US 6,565,509 B1TheraSense, Inc. · 2003
- Analyte monitoring device and methods of use1,062US 7,190,988 B2Abbott Diabetes Care Inc. · 2007
- Analyte monitoring devices and methods of use1,055US 7,003,341 B2Abbott Diabetes Care Inc. · 2006
- Analyte monitoring device and methods of use1,007US 6,990,366 B2TheraSense, Inc. · 2006