H10W 70/427
Bent parts
Official title: {Bent parts}
H10W70/427 (Bent parts) appears on 1,701 US grants and 1,851 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,701
- Published applications
- 1,851
- Assignees
- 402
- Inventors
- 2,918
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 8 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 18 | 0 |
| 1992 | 11 | 0 |
| 1993 | 11 | 0 |
| 1994 | 26 | 0 |
| 1995 | 29 | 0 |
| 1996 | 17 | 0 |
| 1997 | 19 | 0 |
| 1998 | 27 | 0 |
| 1999 | 25 | 0 |
| 2000 | 37 | 0 |
| 2001 | 30 | 9 |
| 2002 | 20 | 29 |
| 2003 | 25 | 30 |
| 2004 | 25 | 27 |
| 2005 | 23 | 42 |
| 2006 | 25 | 28 |
| 2007 | 28 | 43 |
| 2008 | 21 | 58 |
| 2009 | 36 | 84 |
| 2010 | 44 | 47 |
| 2011 | 60 | 56 |
| 2012 | 59 | 37 |
| 2013 | 46 | 55 |
| 2014 | 49 | 62 |
| 2015 | 78 | 113 |
| 2016 | 94 | 117 |
| 2017 | 96 | 109 |
| 2018 | 101 | 99 |
| 2019 | 76 | 93 |
| 2020 | 84 | 111 |
| 2021 | 89 | 112 |
| 2022 | 77 | 84 |
| 2023 | 74 | 115 |
| 2024 | 69 | 116 |
| 2025 | 58 | 104 |
| 2026 | 60 | 71 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Lead frame with a tie bar having branch part29 Sep 2026US 12,751,294 B2Diodes Incorporated
- Semiconductor device29 Sep 2026US 12,751,296 B2Power Master Semiconductor Co., Ltd.
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Method for manufacturing semiconductor apparatus and semiconductor apparatus8 Sep 2026US 12,733,511 B2Rohm Co., Ltd.
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
- Double sided multi chip for leaded package1 Oct 2026US 2026/0305380 A1
- Power semiconductor package including a molded body with protrusion and method for fabricating the same1 Oct 2026US 2026/0305381 A1
Most cited
By later US patents
- Packed semiconductor device with wrap around external leads440US 5,835,988 AMitsubishi Denki Kabushiki Kaisha · 1998
- Plastic integrated circuit device package and leadframe having partially undercut leads and die pad364US 6,281,568 B1Amkor Technology, Inc. · 2001
- Leadless semiconductor device and method for making the same346US 5,172,214 AMotorola, Inc. · 1992
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Molded electronic package with compression structures319US 5,041,902 AMotorola, Inc. · 1991