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US 5,172,214 AGranted
Leadless semiconductor device and method for making the same
AssigneeMotorola, Inc.
InventorJames J. Casto
Life of this patent
Estimating the term…
Abstract
A semiconductor device having a thin package profile is leadless, thereby minimizing necessary mounting space on a substrate. In one form, a semiconductor device has a semiconductor die electrically coupled to a plurality of conductive leads. Each lead has a first portion, a second portion, and an intermediate portion which separates the first and second portions. A package body encapsulates the semiconductor die and the first and intermediate portions of the leads. The second portions of the leads are exposed on the bottom surface of the package body and are used to electrically access the semiconductor die.
Claims12
A leadless semiconductor device comprising:
- a leadframe having a die receiving area and a plurality of leads extending outwardly from positions adjacent the die receiving area, each of the leads having first and second portions and an intermediate portion, the first portion of each lead being closer to the die receiving area than the second portion, and each of the first and second portions being separated by the intermediate portion thereof;
- a semiconductor die positioned at the die receiving area of the leadframe and electrically coupled to the plurality of leads;
- and
- a package body having a top surface, a bottom surface, and a perimeter, wherein the semiconductor die, the plurality of leads, and the die receiving area are completely contained within the package body and wherein a first surface of each of the second portions of the leads and an entire surface of the die receiving area are exposed on and substantially flush with one of either the top surface or bottom surface of the package body.
1 more element
A leadless semiconductor device comprising:
- a semiconductor die;
- a plurality of conductive leads electrically coupled to the semiconductor die, each lead having a first portion for electrical connection to the die and a second portion for subsequent electrical connection to the device, the second portion being separated from the first portion by an intermediate portion;
- and
- a molded package body completely containing the semiconductor die and the plurality of conductive leads wherein a first surface of each second portion is exposed on, and substantially flush with, a side of the package body and a second surface of each second portion is exposed on, and substantially flush with one of either a top surface or a bottom surface of the package body and wherein only the first and second surfaces of the leads are exposed.
1 more element
A method for fabricating a leadless semiconductor device comprising the steps of:
- providing a semiconductor die;
- providing a leadframe having a die receiving area and a plurality of leads extending outwardly from positions adjacent the die receiving area, each of the leads having first and second portions and an intermediate portion, the first portion being closer to the die receiving area than the second portion, and the first and second portions being separated by the intermediate portion;
- electrically coupling each first portion of the plurality of leads to the semiconductor die;
- encapsulating the semiconductor die and portions of the plurality of leads with a resin encapsulating material to form a package body which completely contains the first portions, intermediate portions, and second portions of the leads such that a first surface of each of the second portions of the leads and an entire surface of the die receiving area are exposed on, and substantially flush with, one of either a top surface or a bottom surface of the package body;
- and
- severing the plurality leads to create a second surface of each of the second portions of the leads which is exposed on, and substantially flush with, a side of the package to form the leadless semiconductor device in which only the first and second surfaces of the leads are exposed.
3 more elements
A method for fabricating a leadless semiconductor device comprising the steps of:
- providing a semiconductor die;
- providing a leadframe having a plurality of leads, each of the leads having first and second portions and an intermediate portion, the first portions of the leads being used for electrical connection to the die, the second portions of the leads being used for electrical connection to the device, and the first and second portions being separated by the intermediate portion;
- electrically coupling the first portions of each of the plurality of leads to the semiconductor die;
- forming a package body from a resin encapsulating material, the package body completely containing the semiconductor die and the first, second, and intermediate portions of the plurality of leads such that a first surface of each of the second portions of the leads is exposed on, and substantially flush with, either a top surface or a bottom surface of the package body, such that a second surface of each second portion of the leads is exposed on, and substantially flush with a side of the package body, and such that only the first and second surfaces of the leads are exposed;
- and
- plating the first and second exposed surfaces of the second portions of the leads with a conductive material.
3 more elements
Dependencies are inferred from the claim text.