H10W 70/429
Being the outer leads
Official title: {being the outer leads}
H10W70/429 (Being the outer leads) appears on 728 US grants and 808 published applications in this corpus.
Search patents in H10W- Granted patents
- 728
- Published applications
- 808
- Assignees
- 229
- Inventors
- 1,463
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 7 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 12 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 11 | 0 |
| 1995 | 20 | 0 |
| 1996 | 14 | 0 |
| 1997 | 11 | 0 |
| 1998 | 15 | 0 |
| 1999 | 12 | 0 |
| 2000 | 18 | 0 |
| 2001 | 12 | 5 |
| 2002 | 8 | 6 |
| 2003 | 9 | 14 |
| 2004 | 10 | 9 |
| 2005 | 6 | 12 |
| 2006 | 9 | 7 |
| 2007 | 11 | 18 |
| 2008 | 8 | 19 |
| 2009 | 6 | 22 |
| 2010 | 9 | 13 |
| 2011 | 10 | 13 |
| 2012 | 15 | 10 |
| 2013 | 11 | 13 |
| 2014 | 18 | 25 |
| 2015 | 24 | 42 |
| 2016 | 36 | 49 |
| 2017 | 37 | 43 |
| 2018 | 43 | 48 |
| 2019 | 39 | 49 |
| 2020 | 45 | 67 |
| 2021 | 41 | 46 |
| 2022 | 37 | 40 |
| 2023 | 34 | 62 |
| 2024 | 38 | 70 |
| 2025 | 29 | 56 |
| 2026 | 30 | 50 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Jump-fusing and tailored PCB system for loop inductance reduction8 Sep 2026US 12,733,513 B2Texas Instruments Incorporated
- Semiconductor device and method of manufacturing semiconductor device8 Sep 2026US 12,733,514 B2Mitsubishi Electric Corporation
- Semiconductor device25 Aug 2026US 12,721,212 B2Rohm Co., Ltd.
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
- Double sided multi chip for leaded package1 Oct 2026US 2026/0305380 A1
- Power semiconductor package including a molded body with protrusion and method for fabricating the same1 Oct 2026US 2026/0305381 A1
Most cited
By later US patents
- Packed semiconductor device with wrap around external leads440US 5,835,988 AMitsubishi Denki Kabushiki Kaisha · 1998
- Plastic integrated circuit device package and leadframe having partially undercut leads and die pad364US 6,281,568 B1Amkor Technology, Inc. · 2001
- Leadless semiconductor device and method for making the same346US 5,172,214 AMotorola, Inc. · 1992
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Package stack via bottom leaded plastic (BLP) packaging252US 5,986,209 AMicron Technology, Inc. · 1999