Semiconductor device

A semiconductor device comprising:

• a semiconductor element;
• a first lead having a first section on which the semiconductor element is mounted;
• a second lead spaced apart from the first lead and electrically connected to the semiconductor element;
• and
• a resin section covering the semiconductor element and a portion of each of the first lead and the second lead,
• wherein the first section has a first obverse surface and a first reverse surface facing away from each other in a thickness direction,
• the semiconductor element has an element obverse surface and an element reverse surface facing away from each other in the thickness direction,
• the element reverse surface faces the first obverse surface,
• the resin section has a resin obverse surface and a resin reverse surface facing away from each other in the thickness direction,
• the first reverse surface is exposed from the resin reverse surface,
• an area ratio of the first reverse surface to an area of a region surrounded by an outer periphery edge of the resin reverse surface is between 40% and 50%, both inclusive,
• the first lead has two second sections flanking the first section in a first direction perpendicular to the thickness direction and being offset from the first section in a sense of the thickness direction in which the first obverse surface faces,
• each of the two second sections has a second obverse surface facing a same side as the first obverse surface in the thickness direction, and a second reverse surface facing a same side as the first reverse surface in the thickness direction,
• the resin section has two resin first side surfaces located between the resin obverse surface and the resin reverse surface and spaced apart from each other in the first direction,
• each of the two resin first side surfaces has a first region between the resin obverse surface and the second obverse surface in the thickness direction, a second region between the second reverse surface and the resin reverse surface in the thickness direction, and a third region between the second obverse surface and the second reverse surface in the thickness direction,
• each of the two second sections has a recess recessed from the second obverse surface in the thickness direction, and
• the recess overlaps with the third region of a corresponding one of the resin first side surfaces as viewed in a second direction perpendicular to the thickness direction and the first direction.