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US 12,751,297 B2Granted
Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices
AssigneeInfineon Technologies Austria AG
InventorsStefan Schwab, Julian Treu
Life of this patent
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Abstract
A semiconductor device comprises a leadframe comprising a die pad and a plurality of leads, a semiconductor die disposed on the die pad, the semiconductor die including a contact pad on a first main face thereof, and one or more bond wires connected with the contact pad, wherein a lead of the plurality of leads is bent back and connected with at least one first bond wire of the one or more bond wires.
Claims13
A semiconductor device, comprising:
- a leadframe comprising a die pad and a plurality of leads;
- a semiconductor die disposed on the die pad, the semiconductor die comprising a contact pad on a first main face thereof;
- and
- one or more bond wires connected with the contact pad;
- wherein
- a lead of the plurality of leads is bent back such that in a bent back section of the lead a lower surface of the lead overlaps with and faces the leadframe and such that an upper surface of the lead that is opposite from the lower surface of the lead in the bent back section faces away from the lead frame, and wherein at least one first bond wire of the one or more bond wires is attached to the upper surface of the lead in the bent back section that is opposite from the lower surface.
3 more elements
A semiconductor device, comprising:
- a leadframe comprising a die pad, a plurality of leads, and a crossbar connected with a subgroup of the plurality of leads;
- a semiconductor die disposed on the die pad, the semiconductor die comprising a contact pad on a first main face thereof;
- one or more bond wires connected between the contact pad and the crossbar;
- and
- an electrical member connected to the crossbar in a manner that a portion of the electric member is connected to end portions of the bond wires,
- wherein the electrical member is attached exclusively with an upper side of the crossbar.
3 more elements
A semiconductor device, comprising:
- a leadframe comprising a die pad and a plurality of leads, wherein a first lead of the plurality of leads is bent back and a second lead of the plurality of leads is bent back such that in a bent back section of the second lead a lower surface of the second lead overlaps with and faces the leadframe and such that an upper surface of the second lead that is opposite from the lower surface of the second lead in the bent back section faces away from the lead frame;
- a semiconductor die disposed on the die pad, the semiconductor die comprising a contact pad on a first main face thereof;
- further comprising
- a further device disposed on an upper surface of the first lead,
- wherein the second lead is connected by bond wires with one or both of a gate pad or a source sense pad of the semiconductor die, and
- wherein the bond wires are attached to the upper surface of the second lead in the bent back section that is opposite from the lower surface.
3 more elements
Dependencies are inferred from the claim text.