Jump-fusing and tailored PCB system for loop inductance reduction

A system, comprising:

• an electronic device, comprising:
• conductive leads arranged in a row along a side of a package structure and including a conductive first lead, a conductive second lead, and a conductive third lead, the first and second leads non-adjacent in the row, and the third lead between the first and second leads in the row,
• a conductive crossbar that electrically connects the first and second leads,
• a first bond wire that electrically connects a first conductive feature of a semiconductor die to one of the crossbar, the first lead, and the second lead, and
• a second bond wire that electrically connects a second conductive feature of the semiconductor die to the third lead;
• and
• a circuit board having a substrate with a first side to which the electronic device is mounted, and an opposite second side, the circuit board comprising:
• a conductive first trace layer on the first side of the substrate and including a base trace, a first trace, a second trace, and a third trace, the base trace extending under the semiconductor die, the first trace extending along the first side under the first lead, the second trace extending under the second lead, and the third trace extending under the conductive crossbar and joining the first and second traces,
• a conductive second trace layer on the second side of the substrate and extending under the base trace, the first trace, the second trace, and the third trace, and
• conductive vias extending between and electrically connecting the second trace layer to the base trace, the first trace, the second trace, and the third trace of the first trace layer.