H10W 70/442
Of multiple leadframes in a single chip
Official title: {of multiple leadframes in a single chip}
H10W70/442 (Of multiple leadframes in a single chip) appears on 912 US grants and 1,004 published applications in this corpus.
Search patents in H10W- Granted patents
- 912
- Published applications
- 1,004
- Assignees
- 289
- Inventors
- 1,779
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 7 | 0 |
| 1992 | 7 | 0 |
| 1993 | 7 | 0 |
| 1994 | 11 | 0 |
| 1995 | 10 | 0 |
| 1996 | 13 | 0 |
| 1997 | 11 | 0 |
| 1998 | 9 | 0 |
| 1999 | 7 | 0 |
| 2000 | 8 | 0 |
| 2001 | 10 | 2 |
| 2002 | 9 | 10 |
| 2003 | 9 | 10 |
| 2004 | 9 | 16 |
| 2005 | 14 | 17 |
| 2006 | 12 | 18 |
| 2007 | 12 | 30 |
| 2008 | 12 | 19 |
| 2009 | 20 | 28 |
| 2010 | 16 | 25 |
| 2011 | 27 | 34 |
| 2012 | 19 | 31 |
| 2013 | 31 | 50 |
| 2014 | 44 | 41 |
| 2015 | 53 | 59 |
| 2016 | 49 | 68 |
| 2017 | 51 | 62 |
| 2018 | 56 | 60 |
| 2019 | 65 | 78 |
| 2020 | 61 | 61 |
| 2021 | 45 | 63 |
| 2022 | 59 | 53 |
| 2023 | 33 | 43 |
| 2024 | 34 | 50 |
| 2025 | 32 | 49 |
| 2026 | 23 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor module having double sided heat dissipation structure and method for fabricating the same15 Sep 2026US 12,740,410 B2Lx Semicon Co., Ltd.
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- Semiconductor device3 Sep 2026US 2026/0262546 A1Rohm Co., Ltd.
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Most cited
By later US patents
- Semiconductor package having stacked dice and leadframes and method of fabrication303US 6,303,981 B1Micron Technology, Inc. · 2001
- Semiconductor device and module289US 5,592,019 AMitsubishi Denki Kabushiki Kaisha · 1997
- Semiconductor device having a particular conductive lead structure228US 5,157,475 AOki Electric Industry Co., Ltd. · 1992
- Resin mold semiconductor device218US 5,365,106 AKabushiki Kaisha Toshiba · 1994
- Semiconductor device, lead frame and method for manufacturing semiconductor devices187US 5,493,151 AKabushiki Kaisha Toshiba · 1996