Transfer molded module
AssigneeMitsubishi Electric Corporation
InventorsTakafumi KUSABA, Hidetoshi YAMAKAWA
Life of this patent
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Abstract
A transfer molded module includes: a p-side frame; an n-side frame; a high-side first power device connected to the p-side frame; a low-side second power device connected to the n-side frame; a monitoring terminal; a resistor connected between the p-side frame and the monitoring terminal; and an encapsulating resin encapsulating the p-side frame, the n-side frame, the first power device, the second power device, the monitoring terminal, and the resistor, wherein the p-side frame, the n-side frame, and the monitoring terminal are led out from a side surface of the encapsulating resin.
Claims9
A transfer molded module comprising:
- a p-side frame;
- an n-side frame;
- a high-side first power device connected to the p-side frame;
- a low-side second power device connected to the n-side frame;
- a monitoring terminal;
- a resistor connected between the p-side frame and the monitoring terminal;
- and
- an encapsulating resin encapsulating the p-side frame, the n-side frame, the first power device, the second power device, the monitoring terminal, and the resistor,
- wherein the p-side frame, the n-side frame, and the monitoring terminal are led out from a side surface of the encapsulating resin.
Dependencies are inferred from the claim text.