Semiconductor module having double sided heat dissipation structure and method for fabricating the same

Abstract

A stacked semiconductor module having a double-sided heat dissipation structure according to one aspect of the present invention in which semiconductor dies may be arranged in a stacked structure with a heat dissipation substrate interposed there-between. The heat dissipation substrate includes a first heat dissipation substrate; a second heat dissipation substrate disposed below the first heat dissipation substrate to face the first heat dissipation substrate. The stacked semiconductor module includes a first semiconductor die module mounted between the first heat dissipation substrate and the second heat dissipation substrate; a third heat dissipation substrate disposed below the second heat dissipation substrate to face the second heat dissipation substrate; and a second semiconductor die module mounted between the second heat dissipation substrate and the third heat dissipation substrate.

Dependencies are inferred from the claim text.