Semiconductor device provided with insulating element bonded to insulating substrate
AssigneeRohm Co., Ltd.
InventorsYoshizo Osumi, Hiroaki Matsubara, Tomohira Kikuchi, Taro Nishioka
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Abstract
A semiconductor device includes a plurality of conductive members including a die pad, a first semiconductor element and a second semiconductor element each located on the die pad, an insulating element electrically connected to the first semiconductor element and the second semiconductor element and insulating the first semiconductor element and the second semiconductor element from each other, and an insulating substrate interposed between the die pad and the insulating element and bonded to the die pad. The insulating element is bonded to the insulating substrate.
Claims20
A semiconductor device comprising:
- a plurality of conductive members including a die pad;
- a first semiconductor element and a second semiconductor element each located on the die pad;
- an insulating element electrically connected to the first semiconductor element and the second semiconductor element and insulating the first semiconductor element and the second semiconductor element from each other;
- and
- an insulating substrate interposed between the die pad and the insulating element and bonded to the die pad,
- wherein the insulating element is bonded to the insulating substrate.
A semiconductor device comprising:
- a plurality of conductive members including a die pad;
- a first semiconductor element and a second semiconductor element that are each located on the die pad;
- an insulating element that is electrically connected to the first semiconductor element and the second semiconductor element and that insulates the first semiconductor element and the second semiconductor element from each other;
- an insulating substrate interposed between the die pad and the insulating element and bonded to the die pad;
- a first bonding layer interposed between the die pad and the insulating substrate;
- and
- a second bonding layer interposed between the insulating substrate and the insulating element,
- wherein the insulating element is bonded to the insulating substrate via the second bonding layer.
Dependencies are inferred from the claim text.