Electronic device

An electronic device comprising:

• a substrate that includes a substrate obverse surface and a substrate reverse surface that are spaced apart from each other in a thickness direction;
• an electronic element that includes an element obverse surface on which a first obverse surface electrode is formed;
• a wiring portion that is formed on the substrate obverse surface and transmits a control signal for controlling the electronic element;
• a conduction member that includes an obverse surface and a reverse surface that are spaced apart from each other in the thickness direction, the reverse surface being joined to the wiring portion;
• a conductive first lead that is arranged on the substrate obverse surface;
• and
• a first connecting member that has a first joined portion joined to the obverse surface of the conduction member and a second joined portion joined to the first obverse surface electrode,
• wherein the first lead includes a first pad portion that is spaced apart from the wiring portion and to which the electronic element is joined,
• the wiring portion and the first obverse surface electrode are electrically connected to each other via the conduction member and the first connecting member,
• the first pad portion is greater in size along the thickness direction than the wiring portion, and
• a thickness of the conduction member is larger than a difference between a thickness of the wiring portion and a thickness of the first pad portion.