H10W 70/435
Of insulating layers on leadframes
Official title: {of insulating layers on leadframes, e.g. bridging members}
H10W70/435 (Of insulating layers on leadframes) appears on 520 US grants and 416 published applications in this corpus.
Search patents in H10W- Granted patents
- 520
- Published applications
- 416
- Assignees
- 191
- Inventors
- 1,040
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 10 | 0 |
| 1993 | 18 | 0 |
| 1994 | 20 | 0 |
| 1995 | 22 | 0 |
| 1996 | 11 | 0 |
| 1997 | 17 | 0 |
| 1998 | 15 | 0 |
| 1999 | 16 | 0 |
| 2000 | 18 | 0 |
| 2001 | 7 | 2 |
| 2002 | 2 | 6 |
| 2003 | 3 | 10 |
| 2004 | 7 | 8 |
| 2005 | 8 | 13 |
| 2006 | 7 | 10 |
| 2007 | 9 | 20 |
| 2008 | 11 | 19 |
| 2009 | 5 | 17 |
| 2010 | 21 | 12 |
| 2011 | 10 | 7 |
| 2012 | 15 | 14 |
| 2013 | 12 | 8 |
| 2014 | 8 | 12 |
| 2015 | 17 | 23 |
| 2016 | 23 | 23 |
| 2017 | 26 | 29 |
| 2018 | 30 | 24 |
| 2019 | 30 | 29 |
| 2020 | 23 | 17 |
| 2021 | 14 | 13 |
| 2022 | 16 | 22 |
| 2023 | 13 | 22 |
| 2024 | 11 | 18 |
| 2025 | 14 | 19 |
| 2026 | 8 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sensor package with cavity created using sacrificial material28 Jul 2026US 12,696,791 B2Texas Instruments Incorporated
- Semiconductor equipment28 Jul 2026US 12,696,821 B2Rohm Co., Ltd.
- Integrated circuit packaging with insulation structure to control gap height and die tilt30 Jun 2026US 12,672,592 B2Allegro MicroSystems, LLC
- Semiconductor device23 Jun 2026US 12,666,975 B2Rohm Co., Ltd.
- Semiconductor device16 Jun 2026US 12,660,642 B2Mitsubishi Electric Corporation
- Electronic module1 Oct 2026US 2026/0305382 A1Shindengen Electric Manufacturing Co., Ltd.
- Package with t-shaped source electrode1 Oct 2026US 2026/0305387 A1GaNrich Semiconductor Corporation
- Semiconductor device17 Sep 2026US 2026/0282947 A1Rohm Co., Ltd.
- Conductive path for a lead-frame current sensor27 Aug 2026US 2026/0255986 A1STMicroelectronics International N. V.
- Semiconductor devices and methods of manufacturing semiconductor devices27 Aug 2026US 2026/0255987 A1Amkor Technology Singapore Holding Pte.Ltd.
Most cited
By later US patents
- Multi-chip semiconductor arrangements using flip chip dies446US 5,399,898 ALSI Logic Corporation · 1995
- Packaged semiconductor device having tab tape and particular power distribution lead structure332US 5,252,853 AMitsubishi Denki Kabushiki Kaisha · 1993
- Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof266US 8,420,447 B2STATS ChipPAC, Ltd. · 2013
- Semiconductor package and method for manufacturing the same252US 5,444,301 AGoldstar Electron Co., Ltd. · 1995
- Adhesive tapes247US 5,277,972 ATomoegawa Paper Co., Ltd. · 1994