Semiconductor equipment

A semiconductor device comprising:

• a first die pad including a first obverse surface facing in a thickness direction;
• a second die pad spaced apart from the first die pad in a first direction orthogonal to the thickness direction and including a second obverse surface facing in the thickness direction;
• a first semiconductor element mounted on the first obverse surface, the first semiconductor element being smaller in area than the first obverse surface as viewed in the thickness direction;
• a second semiconductor element mounted on the second obverse surface, the second semiconductor element being smaller in area than the second obverse surface as viewed in the thickness direction;
• an insulating element mounted on the first obverse surface or the second obverse surface and located between the first semiconductor element and the second semiconductor element in the first direction, the insulating element being configured to provide electrical insulation between the first semiconductor element and the second semiconductor element while relaying a signal between the first semiconductor element and the second semiconductor element;
• a first wire having a first end and a second end opposite to the first end, the first wire being bonded to the first semiconductor element at the first end and to the first obverse surface at the second end;
• and
• a sealing resin covering the first semiconductor element, the second semiconductor element and the insulating element,
• wherein the first die pad includes:
• a first bond portion located to be offset to a first side of a second direction orthogonal to the thickness direction and the first direction with respect to the first semiconductor element, the second end of the first wire being bonded to the first bond portion;
• and
• a first opening located between the first bond portion and the first semiconductor element in the second direction and including an opening end in the first obverse surface.