Integrated circuit packaging with insulation structure to control gap height and die tilt
AssigneeAllegro MicroSystems, LLC
InventorsDavid Youm, Weidong Wang, Natasha Healey
Life of this patent
Estimating the term…
Abstract
A current sensor integrated circuit (IC) package includes an insulation structure disposed between a semiconductor die and a lead frame to control gap height and prevent the die from tilting and dropping the magnetic field coupling between the die the primary conductor. An insulation structure is disposed between the die and the lead frame such that the die remains level and magnetic coupling remains intact. An insulation structure may control the gap height between the lead frame and the die evenly during transfer molding, by supporting the die across its length and/or width. Epoxy dots are also or instead used to control the gap height and eliminate die tilt.
Claims34
A current sensor integrated circuit (IC) package comprising:
- a lead frame comprising a primary conductor and signal leads, the lead frame having a lead frame surface;
- a semiconductor die having a die surface adjacent to the lead frame surface, the semiconductor die comprising a magnetic field sensing element supported by the semiconductor die, wherein the magnetic field sensing element is configured to sense a magnetic field associated with a current through the primary conductor and generate an output signal indicative of the current;
- and
- an insulation structure having first and second portions, wherein:
- the first portion is located between a first location on the die surface and the primary conductor;
- and
- the second portion is located between a second location on the die surface and a first one of the signal leads;
- wherein the insulation structure is configured to prevent a tilt of the semiconductor die.
A method of manufacturing a current sensor integrated circuit (IC) package, the method comprising:
- providing a lead frame comprising a primary conductor and signal leads, the lead frame having a lead frame surface;
- positioning a semiconductor die having a die surface adjacent to the lead frame surface, wherein the semiconductor die supports a magnetic field sensing element, the magnetic field sensing element configured to sense a magnetic field associated with a current through the primary conductor and to generate an output signal indicative of the current;
- positioning a first portion of an insulation structure between a first location on the die surface and the primary conductor;
- and
- positioning a second portion of the insulation structure between a second location on the die surface and a first one of the signal leads;
- wherein the insulation structure is configured to prevent a tilt of the semiconductor die.
A current sensor integrated circuit (IC) package comprising:
- a lead frame comprising a primary conductor and signal leads, the lead frame having a lead frame surface;
- a semiconductor die having a die surface adjacent to the lead frame surface, the semiconductor die comprising a magnetic field sensing element supported by the semiconductor die, wherein the magnetic field sensing element is configured to sense a magnetic field associated with a current through the primary conductor and generate an output signal indicative of the current;
- and
- an insulation structure having first and second portions, wherein:
- the first portion is located between a first location on the die surface and the primary conductor;
- and
- the second portion is located between a second location on the die surface and a first one of the signal leads;
- wherein the insulation structure is configured to form a first gap height between the first location on the die surface and the primary conductor and a second gap height between the second location on the die surface and the first one of the signal leads.
Dependencies are inferred from the claim text.