Sensor package with cavity created using sacrificial material
AssigneeTexas Instruments Incorporated
InventorsDaiki Komatsu, Makoto Shibuya
Life of this patent
Estimating the term…
Abstract
An integrated circuit package includes a semiconductor die having a first surface and a second surface. The first surface is attached to a top surface of a die attach pad, and the second surface has a sensing area thereon. A mold compound covers or encapsulates at least a portion of the die attach pad and the semiconductor die. A channel is formed in a top portion of the mold compound. The channel extends from a first side of the mold compound to a second side of the mold compound. A cavity is formed between the channel and the sensing area so that the sensing area is exposed to the environment.
Claims20
An integrated circuit package, comprising:
- a die attach pad (DAP) having a top surface;
- a semiconductor die having a first surface and a second surface, the first surface attached to the top surface of the DAP, the second surface having a sensing area thereon;
- a mold compound covering at least a portion of the DAP and the semiconductor die;
- a channel formed in a top portion of the mold compound, the channel including at least two side walls extending from a first side of the mold compound to a second side of the mold compound, the first side and the second side along a periphery of the package, the at least two side walls exposed to an environment exterior to the integrated circuit package;
- and
- a cavity formed between the channel and the sensing area so that the sensing area is exposed to the environment.
A sensor package, comprising:
- a sensor attach area on a lead frame;
- a sensor device having a first surface and a second surface, the first surface attached to the sensor attach area, the second surface having a sensing area thereon;
- a mold compound covering at least a portion of the lead frame and the sensor device;
- a channel formed in a top portion of the mold compound, the channel including at least two side walls extending across a width of the mold compound, the at least two side walls extend between two opposite side surfaces along a periphery of the package, the at least two side walls exposed to an environment exterior to the sensor package;
- and
- a cavity formed between the channel and the sensing area so that the sensing area is exposed to the environment.
An integrated circuit (IC) package, comprising:
- a semiconductor die including a sensor attached to a die attach pad (DAP) and electrically connected to a lead of the IC package;
- a mold compound covering at least a portion of the DAP, the lead, and the semiconductor die;
- a first cavity extending from a plane along a top surface of the mold compound, the first cavity extending between a plane along a first side surface of the mold compound and a plane along a second side surface of the mold compound, the first side surface and the second side surface along a periphery of the package, the first cavity exposed to an exterior environment of the IC package;
- and
- a second cavity between the first cavity and the semiconductor die, the second cavity exposed to the environment.
Dependencies are inferred from the claim text.