Conductive path for a lead-frame current sensor
AssigneeSTMicroelectronics International N.V.
InventorsMark Andrew SHAW, Marco DEL SARTO, Dario PACI, Andrea RATTI
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AssigneeSTMicroelectronics International N.V.
InventorsMark Andrew SHAW, Marco DEL SARTO, Dario PACI, Andrea RATTI
Estimating the term…
An example lead-frame package, a lead-frame current sensor, and a method for determining a signal current of an electrical signal at a lead-frame current sensor are provided. An example lead-frame package includes an interface surface and a conductive path. The conductive path configured to receive an electrical signal with a signal current. The conductive path comprising an input pad, output pad, and bridge portion. The input pad forming a first portion of the interface surface. The output pad forming a second portion of the interface surface, wherein a separation gap is defined between the input pad and the output pad. The bridge portion electrically connecting the input pad to the output pad, wherein the bridge portion is removed from the interface surface. The separation gap is tapered such that the separation gap linearly converges toward the bridge portion electrically connecting the input pad and the output pad.
A lead-frame package comprising:
A lead-frame current sensor comprising:
A method for determining a signal current associated with an electrical signal, the method comprising:
Dependencies are inferred from the claim text.