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US 8,420,447 B2Granted
Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsLionel Chien Hui Tay, Henry Descalzo Bathan, Zigmund Ramirez Camacho
Life of this patent
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Abstract
An integrated circuit packaging system and method of manufacture thereof includes: leads and a paddle; a first encapsulant molded between the leads and the paddle, the first encapsulant thinner than the leads; a non-conductive layer over the paddle; and conductive traces directly on the leads, the first encapsulant, and the non-conductive layer.
Claims20
A method of manufacture of an
- integrated circuit packaging system comprising:
- forming a leadframe including leads and a paddle;
- molding a first encapsulant in the leadframe between the leads and the paddle, the first
- encapsulant thinner than the leads;
- forming a non-conductive layer over the paddle;
- and
- forming conductive traces each having a side, the side directly on the lead, the first
- encapsulant, and the non-conductive layer.
5 more elements
A method of manufacture of an integrated circuit packaging system comprising:
- forming a leadframe including leads and a paddle;
- molding a first encapsulant in the leadframe between the leads and the paddle, the first encapsulant coplanar with the top and bottom surfaces of the paddle;
- forming a non-conductive layer over the paddle;
- forming straight or bent conductive traces each having a side, the side directly on the lead, the first encapsulant, and the non-conductive layer;
- and
- separating the leads from each other.
3 more elements
An integrated circuit packaging system comprising:
- leads
- a paddle;
- a first encapsulant molded between the leads and the paddle, the first encapsulant
- thinner than the leads;
- a non-conductive layer over the paddle;
- and
- conductive traces each having a side, the side directly on the lead, the first encapsulant, and the non-conductive layer.
4 more elements
Dependencies are inferred from the claim text.