Semiconductor package and method for manufacturing the same

Abstract

A plastic semiconductor package and a method for producing the same. The package comprises a plurality of chip signal transmitting leads protruded from a semiconductor chip and functioning as electrical passage, a plurality of polyimide tapes each attached to the corresponding lead and having the same width as that of the lead, a plurality of insulating double-sided tapes each attached to a side of an upper surface of the corresponding lead for attaching the lead to the semiconductor chip, a plurality of conductive bumps each disposed to the other side of the upper surface of the corresponding lead for electrically connecting the lead to the semiconductor chip, and mold resin enveloping a predetermined area including the semiconductor chip and the leads. Since the package does not have metal wire, it is possible to reduce deterioration of a package due to wire-bonding, since the method of the invention eliminates a trimming/forming step to simplify its process.

Dependencies are inferred from the claim text.