H10W 70/456
Materials
Official title: {Materials}
H10W70/456 (Materials) appears on 2,070 US grants and 2,312 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,070
- Published applications
- 2,312
- Assignees
- 515
- Inventors
- 3,549
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 8 | 0 |
| 1987 | 6 | 0 |
| 1988 | 13 | 0 |
| 1989 | 9 | 0 |
| 1990 | 13 | 0 |
| 1991 | 15 | 0 |
| 1992 | 16 | 0 |
| 1993 | 14 | 0 |
| 1994 | 22 | 0 |
| 1995 | 21 | 0 |
| 1996 | 16 | 0 |
| 1997 | 20 | 0 |
| 1998 | 26 | 0 |
| 1999 | 29 | 0 |
| 2000 | 41 | 0 |
| 2001 | 24 | 16 |
| 2002 | 29 | 39 |
| 2003 | 31 | 34 |
| 2004 | 29 | 51 |
| 2005 | 27 | 49 |
| 2006 | 26 | 53 |
| 2007 | 41 | 70 |
| 2008 | 33 | 67 |
| 2009 | 33 | 63 |
| 2010 | 51 | 80 |
| 2011 | 66 | 87 |
| 2012 | 71 | 111 |
| 2013 | 89 | 92 |
| 2014 | 97 | 112 |
| 2015 | 114 | 98 |
| 2016 | 120 | 127 |
| 2017 | 114 | 147 |
| 2018 | 115 | 105 |
| 2019 | 96 | 115 |
| 2020 | 101 | 146 |
| 2021 | 92 | 116 |
| 2022 | 95 | 124 |
| 2023 | 90 | 104 |
| 2024 | 80 | 111 |
| 2025 | 71 | 121 |
| 2026 | 51 | 74 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Power semiconductor package6 Oct 2026US 12,757,757 B2Pierburg GmbH
- Lead frame15 Sep 2026US 12,740,437 B2Chang Wah Technology Co., Ltd.
- Diode layer stack flip-chip mounted to a leadframe by use of a copper nickel tin metallization stack and diffusion soldering15 Sep 2026US 12,740,438 B2Infineon Technologies Austria AG
- Cleaning liquid and method for manufacturing semiconductor device8 Sep 2026US 12,729,348 B2Kabushiki Kaisha Toshiba
- Semiconductor package or a printed circuit board, both modified to one or more of reduce, inverse or utilize magnetic coupling caused by the load current of a semiconductor transistor25 Aug 2026US 12,721,186 B2Infineon Technologies Austria AG
- Grounded leads in a quad-flat package8 Oct 2026US 2026/0314439 A1STMicroelectronics International N. V.
- Interdigital capacitor1 Oct 2026US 2026/0305385 A1
- Power device package1 Oct 2026US 2026/0305466 A1GaNrich Semiconductor Corporation
- Cascode device package with dsdb bjt and fets1 Oct 2026US 2026/0305503 A1Ideal Power Inc.
- Semiconductor device24 Sep 2026US 2026/0293686 A1Rohm Co., Ltd.
Most cited
By later US patents
- Semiconductor device and method of manufacturing thereof293US 4,707,724 AHitachi, Ltd. · 1987
- Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof247US 4,920,074 AHitachi, Ltd. · 1990
- Semiconductor device having leads for mounting to a surface of a printed circuit board244US 5,067,007 AHitachi, Ltd. · 1991
- Leadframes with selective palladium plating204US 6,194,777 B1Texas Instruments Incorporated · 2001
- Partially patterned lead frames and methods of making and using the same in semiconductor packaging200US 6,812,552 B2Advanced Interconnect Technologies Limited · 2004