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US 12,729,348 B2Granted
Cleaning liquid and method for manufacturing semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorMasato Yasui
Life of this patent
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Abstract
In general, according to one embodiment, a cleaning liquid includes a glycol ether-based cleaning agent and a compound represented by chemical formula (1) below, where R is an NH2 group or H, and n is 1 or more.
Claims16
A cleaning liquid comprising:
- a glycol ether-based cleaning agent;
- and
- a compound represented by chemical formula (1) below,
- wherein R is an NH2 group or H, and n is 1 or more, and
- wherein a content of the glycol ether-based cleaning agent in the cleaning liquid is witihn a range of 90 wt% to 99 wt%.
2 more elements
A cleaning liquid comprising:
- a glycol ether-based cleaning agent;
- and
- a compound represented by a chemical formula (1) below,
- wherein R is an NH2 group or H, and n is 1 or more, and
- wherein a content of the cleaning liquid is within a range of 1 wt % to 2 wt %.
2 more elements
A method for manufacturing a semiconductor device, comprising:
- solder-joining a semiconductor chip to a conductor;
- cleaning the conductor and the semiconductor chip by a cleaning liquid;
- and
- sealing at least part of the conductor and the semiconductor chip with a resin,
- wherein the cleaning liquid comprises:
- a glycol ether-based cleaning agent;
- and
- a compound represented by a chemical formula (1) below, and
- wherein R is an NH2 group or H, and n is 1 or more.
6 more elements
Dependencies are inferred from the claim text.