H10W 70/457
Of metallic layers on leadframes
Official title: {of metallic layers on leadframes}
H10W70/457 (Of metallic layers on leadframes) appears on 1,606 US grants and 1,851 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,606
- Published applications
- 1,851
- Assignees
- 415
- Inventors
- 2,749
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 7 | 0 |
| 1992 | 7 | 0 |
| 1993 | 3 | 0 |
| 1994 | 13 | 0 |
| 1995 | 17 | 0 |
| 1996 | 12 | 0 |
| 1997 | 13 | 0 |
| 1998 | 17 | 0 |
| 1999 | 19 | 0 |
| 2000 | 24 | 0 |
| 2001 | 17 | 14 |
| 2002 | 27 | 35 |
| 2003 | 26 | 27 |
| 2004 | 23 | 37 |
| 2005 | 24 | 44 |
| 2006 | 21 | 48 |
| 2007 | 36 | 55 |
| 2008 | 31 | 56 |
| 2009 | 28 | 50 |
| 2010 | 41 | 62 |
| 2011 | 54 | 77 |
| 2012 | 62 | 100 |
| 2013 | 80 | 73 |
| 2014 | 75 | 87 |
| 2015 | 87 | 73 |
| 2016 | 97 | 106 |
| 2017 | 93 | 121 |
| 2018 | 97 | 90 |
| 2019 | 86 | 84 |
| 2020 | 81 | 118 |
| 2021 | 69 | 89 |
| 2022 | 66 | 89 |
| 2023 | 68 | 77 |
| 2024 | 64 | 86 |
| 2025 | 56 | 97 |
| 2026 | 38 | 56 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power semiconductor package6 Oct 2026US 12,757,757 B2Pierburg GmbH
- Lead frame15 Sep 2026US 12,740,437 B2Chang Wah Technology Co., Ltd.
- Diode layer stack flip-chip mounted to a leadframe by use of a copper nickel tin metallization stack and diffusion soldering15 Sep 2026US 12,740,438 B2Infineon Technologies Austria AG
- Semiconductor device25 Aug 2026US 12,721,247 B2Rohm Co., Ltd.
- Integrated circuit having a routable leadframe11 Aug 2026US 12,707,986 B2Texas Instruments Incorporated
- Power device package1 Oct 2026US 2026/0305466 A1GaNrich Semiconductor Corporation
- Semiconductor device24 Sep 2026US 2026/0293686 A1Rohm Co., Ltd.
- Semiconductor package having internal isolation and copper heat spreader17 Sep 2026US 2026/0282949 A1Alpha and Omega Semiconductor International LP
- Power semiconductor package including a contact pin with a pointed tip and method of fabrication thereof17 Sep 2026US 2026/0282950 A1Infineon Technologies AG
- Semiconductor device packages with reduced form factor10 Sep 2026US 2026/0271745 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Semiconductor device and method of manufacturing thereof293US 4,707,724 AHitachi, Ltd. · 1987
- Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof247US 4,920,074 AHitachi, Ltd. · 1990
- Leadframes with selective palladium plating204US 6,194,777 B1Texas Instruments Incorporated · 2001
- Partially patterned lead frames and methods of making and using the same in semiconductor packaging200US 6,812,552 B2Advanced Interconnect Technologies Limited · 2004
- Low-pin-count chip package and manufacturing method thereof176US 6,238,952 B1Advanced Semiconductor Engineering, Inc. · 2001