Power semiconductor package including a contact pin with a pointed tip and method of fabrication thereof

A method for fabricating a power semiconductor package, the method comprising:

• providing a leadframe comprising a plurality of load terminals and at least one contact pin, the load terminals configured to carry a load current and the contact pin configured to carry a control signal or a sensing signal, wherein a distal end of the contact pin is connected to a frame portion of the leadframe, wherein a first lateral side of the contact pin comprises a tapering at a predefined position, the tapering comprising a first cut surface;
• connecting at least one power semiconductor die to the load terminals and to the contact pin;
• encapsulating the power semiconductor die with an encapsulation body such that the load terminals and the contact pin are exposed from the encapsulation body;
• and
• cutting through the contact pin at the predefined position to separate the contact pin from the frame portion, thereby fabricating a second cut surface and thereby forming a pointed tip facing away from the power semiconductor package,
• wherein the pointed tip comprises the first cut surface and the second cut surface,
• wherein the first cut surface and the second cut surface intersect along an edge, and
• wherein the edge has a width measured perpendicular to a length of the edge of ⅜ or less of a thickness of the contact pin, the thickness being measured along the length of the edge.