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US 12,721,247 B2Granted
Semiconductor device
AssigneeRohm Co., Ltd.
InventorShigeru Hirata
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: an IC; a first lead having an island portion to which the IC is bonded; a second lead having a band-shaped portion; a plurality of additional leads spaced apart from the second lead with the first lead therebetween, and electrically connected to the IC; and a plurality of wires bonded to the IC and the plurality of additional leads. As viewed in the thickness direction, each of the additional leads has an edge facing the island portion. As viewed in the thickness direction, the band-shaped portion has a pair of elongated edges. As viewed in the thickness direction, the edge of the additional lead located closest to the band-shaped portion is positioned between the pair of elongated edges in a predetermined direction perpendicular to the thickness direction.
Claims17
A semiconductor device, comprising:
- at least one IC;
- a first lead having an island portion to which the IC is bonded;
- a second lead having a first band-shaped portion, a second band-shaped portion, and a third band-shaped portion,
- the first band-shaped portion being spaced apart from the island portion in a first direction perpendicular to a thickness direction of the island portion,
- the first band-shaped portion extending in a second direction perpendicular to the thickness direction and the first direction,
- the second band-shaped portion being connected to the first band-shaped portion in a first sense of the second direction,
- an entirety of the second band-shaped portion extending in the first direction, and
- the third band-shaped portion being connected to the first band-shaped portion in a second sense of the second direction and extending in the first direction;
- a third lead spaced apart from the first lead with the second lead therebetween;
- a plurality of first switching elements bonded to the third lead and electrically connected to the IC;
- a plurality of fourth leads spaced apart from the second lead with the third lead therebetween;
- a plurality of second switching elements electrically bonded to the respective fourth leads and electrically connected to the IC and the second lead;
- a plurality of fifth leads spaced apart from the second lead with the first lead therebetween;
- and
- a plurality of wires bonded to the IC and the plurality of fifth leads, wherein
- no leads other than the plurality of fifth leads are spaced apart from the second lead with the first lead therebetween,
- at least a part of the island portion is flanked by the second band-shaped portion and the third band-shaped portion,
- as viewed in the thickness direction, each of the fifth leads has an edge facing the island portion,
- as viewed in the thickness direction, the second band-shaped portion has a pair of first edges spaced apart from each other in the second direction and extending in the first direction, and
- as viewed in the thickness direction, the plurality of fifth leads include a closest fifth lead that is located closest to the second band-shaped portion in the first direction, and the edge of the closest fifth lead is positioned between the pair of first edges in the second direction.
17 more elements
A semiconductor device comprising:
- a first IC;
- a second IC spaced apart from and electrically connected to the first IC;
- a first lead having an island portion to which the first IC and the second IC are bonded;
- a second lead having a first band-shaped portion, a second band-shaped portion, and a third band-shaped portion,
- the first band-shaped portion being spaced apart from the island portion in a first direction perpendicular to a thickness direction of the island portion,
- the first band-shaped portion extending in a second direction perpendicular to the thickness direction and the first direction,
- the second band-shaped portion being connected to the first band-shaped portion in a first sense of the second direction and extending in the first direction, and
- the third band-shaped portion being connected to the first band-shaped portion in a second sense of the second direction and extending in the first direction;
- a third lead spaced apart from the first lead with the second lead therebetween;
- a plurality of first switching elements bonded to the third lead and electrically connected to the second IC;
- a plurality of fourth leads spaced apart from the second lead with the third lead therebetween;
- a plurality of second switching elements electrically bonded to the respective fourth leads and electrically connected to the second IC and the second lead;
- a plurality of fifth leads spaced apart from the second lead with the first lead therebetween, and electrically connected to the first IC;
- and
- a sixth lead, wherein
- at least a part of the island portion is flanked by the second band-shaped portion and the third band-shaped portion,
- the first IC includes a first controller circuit that generates a PWM signal, and a second controller circuit that distributes the PWM signal to three phases,
- the second IC includes a driver circuit that drives the plurality of first switching elements and the plurality of second switching elements based on a signal from the second controller circuit,
- the plurality of fifth leads include a power supply terminal electrically connected to the second controller circuit and the driver circuit,
- the sixth lead is electrically connected to the driver circuit, and
- a voltage applied to the sixth lead is larger than a voltage applied to the power supply terminal.
18 more elements
Dependencies are inferred from the claim text.