Semiconductor package having internal isolation and copper heat spreader
AssigneeAlpha and Omega Semiconductor International LP
InventorsZhiqiang Niu, Jia-long Yuan, Bum-Seok Suh, Heng Li, Xiaorong Ge
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Abstract
A semiconductor package comprising a composite layer, a lead frame, a first semiconductor device, a second semiconductor device, and a molding encapsulation. The lead frame comprises a plurality of leads and a copper heat spreader. A lead frame strip comprises a plurality of lead frames and a plurality of interim members. Each lead frame of the plurality of lead frames comprises a plurality of leads and a copper heat spreader. Each interim member of the plurality of interim members comprises a lower section, a slanted section, and an upper section.
Claims20
A semiconductor package comprising:
- a composite layer comprising:
- a bottom copper layer,
- a top copper layer comprising:
- a first die paddle,
- a second die paddle,
- a first connection paddle, and
- a second connection paddle, and
- a ceramic layer between the bottom copper layer and the top copper layer,
- a lead frame comprising
- a plurality of leads separated from the first die paddle and the second die paddle of the top copper layer of the composite layer,
- a copper heat spreader comprising:
- a body,
- a first elevated portion attached to the first connection paddle of the top copper layer of the composite layer,
- a first bent portion connecting the first elevated portion to the body,
- a second elevated portion attached to the second connection paddle of the top copper layer of the composite layer, and
- a second bent portion connecting the second elevated portion to the body,
- a first semiconductor device attached to the first die paddle of the top copper layer of the composite layer,
- a second semiconductor device attached to the second die paddle of the top copper layer of the composite layer, and
- a molding encapsulation enclosing the first semiconductor device, the second semiconductor device, a majority portion of the composite layer, a majority portion of the copper heat spreader, and a minority portion of the plurality of leads.
A semiconductor package comprising:
- a composite layer comprising:
- a bottom copper layer,
- a top copper layer comprising:
- a first die paddle,
- a second die paddle,
- a ceramic layer between the bottom copper layer and the top copper layer,
- a lead frame comprising:
- a plurality of leads separated from the composite layer,
- a first semiconductor device attached to the first die paddle of the top copper layer of the composite layer,
- a second semiconductor device attached to the second die paddle of the top copper layer of the composite layer,
- each of first one or more bond wires directly connecting the first die paddle of the top copper layer of the composite layer to a respective one of the plurality of leads, each of second one or more bond wires directly connecting the second die paddle of the top copper layer of the composite layer to a respective one of leads of the plurality of leads, and
- a molding encapsulation enclosing the first semiconductor device, the second semiconductor device, a majority portion of the composite layer, and a minority portion of the plurality of leads.
Dependencies are inferred from the claim text.