Semiconductor device having leads for mounting to a surface of a printed circuit board

A semiconductor device having leads for mounting to a printed circuit board surface, comprising:

• an insulating substrate having a plurality of first electrodes arranged on one side of said substrate, said first electrodes being electrically connected to the other side of said substrate by internal wirings;
• a semiconductor chip having integrated circuits and external terminals formed on one surface of said chip, said chip mounted to said other side of said substrate so that said external terminals are electrically connected to said first electrodes by said internal wirings;
• said leads having first and second connecting junctions, said first connecting junctions connecting to said first electrodes, and said leads extending substantially perpendicular to said substrate;
• and
• a plurality of second electrodes arranged on one side of said printed circuit board surface, said second connecting junctions connecting to said second electrodes of said circuit board surface to electrically connect said external terminals of said chip to said second electrodes,
• wherein said leads are made of a material having Young's modulus of smaller than 15.times.10.sup.10 Pa and are curved so that the displacement from the axial direction will become greater than one-half the diameter of said leads and to permit deformation strength to be smaller than the junction strength at each connecting junction of the leads and the electrodes.

A semiconductor module device comprising:

• a plurality of semiconductor devices, each having;
• a first insulating substrate having a plurality of first electrodes arranged on a first side of said substrate, said first electrodes being electrically connected to a second side of said substrate by internal wirings;
• a semiconductor chip having integrated circuits and external terminals formed on one side of said chip, said chip mounted to said second side of said substrate so that said external terminals are electrically connected to said first electrodes by said internal wirings;
• and
• a plurality of leads having first and second connecting junctions, said first connecting junctions connecting to said first electrodes of said substrate, and said leads extending substantially perpendicular to said substrate;
• and
• (b) a printed wiring board having a plurality of second electrodes arrange don one side of said printed wiring board, said second connecting junctions of said leads for each of said substrate electrically connect said external terminals of each of said chips to said second electrodes of said wiring board,
• wherein said leads have a deformation strength that is smaller than the junction strength at each connecting junction of the leads and the electrodes, said leads comprising any one of tungsten, molybdenum, carbon amorphous metal, pseudo elastic material consisting any of Ti-Ni, Ag-Cd, Cu-Al-Ni Ti-Ni-Fe alloy;
• an ultra-high tension material a heat-resistant ultra-high tension material.