H10W 70/458
Of insulating layers on leadframes
Official title: {of insulating layers on leadframes}
H10W70/458 (Of insulating layers on leadframes) appears on 387 US grants and 433 published applications in this corpus.
Search patents in H10W- Granted patents
- 387
- Published applications
- 433
- Assignees
- 147
- Inventors
- 806
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 14 | 0 |
| 2001 | 4 | 1 |
| 2002 | 1 | 3 |
| 2003 | 4 | 8 |
| 2004 | 6 | 12 |
| 2005 | 4 | 5 |
| 2006 | 4 | 4 |
| 2007 | 4 | 11 |
| 2008 | 2 | 10 |
| 2009 | 3 | 8 |
| 2010 | 9 | 13 |
| 2011 | 10 | 11 |
| 2012 | 10 | 9 |
| 2013 | 8 | 20 |
| 2014 | 17 | 16 |
| 2015 | 24 | 21 |
| 2016 | 27 | 24 |
| 2017 | 24 | 33 |
| 2018 | 23 | 24 |
| 2019 | 18 | 35 |
| 2020 | 23 | 28 |
| 2021 | 23 | 19 |
| 2022 | 24 | 30 |
| 2023 | 19 | 26 |
| 2024 | 18 | 22 |
| 2025 | 15 | 20 |
| 2026 | 8 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Lead frame15 Sep 2026US 12,740,437 B2Chang Wah Technology Co., Ltd.
- Semiconductor package or a printed circuit board, both modified to one or more of reduce, inverse or utilize magnetic coupling caused by the load current of a semiconductor transistor25 Aug 2026US 12,721,186 B2Infineon Technologies Austria AG
- Semiconductor device16 Jun 2026US 12,660,642 B2Mitsubishi Electric Corporation
- Interdigital capacitor16 Jun 2026US 12,660,643 B2Texas Instruments Incorporated
- Semiconductor device28 Apr 2026US 12,616,076 B2Fuji Electric Co., Ltd.
- Grounded leads in a quad-flat package8 Oct 2026US 2026/0314439 A1STMicroelectronics International N. V.
- Interdigital capacitor1 Oct 2026US 2026/0305385 A1
- Cascode device package with dsdb bjt and fets1 Oct 2026US 2026/0305503 A1Ideal Power Inc.
- Semiconductor devices and methods of manufacturing semiconductor devices27 Aug 2026US 2026/0255987 A1Amkor Technology Singapore Holding Pte.Ltd.
- Insulation structure for electrical isolation6 Aug 2026US 2026/0231785 A1Texas Instruments Incorporated
Most cited
By later US patents
- Electronic device and a manufacturing method for the same168US 5,057,900 ASemiconductor Energy Laboratory Co.Ltd. · 1991
- Semiconductor device117US 5,068,712 AHitachi, Ltd. · 1991
- Semiconductor device, and manufacturing method of the same116US 6,087,715 AAnam Industrial Co., Ltd. · 2000
- Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers87US 5,643,834 ASumitomo Electric Industries, Ltd. · 1997
- Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution69US 5,227,232 A1993