Insulation structure for electrical isolation

An integrated circuit (IC) device comprising:

• a conductive layer including a first lead and a second lead separated by a gap, the conductive layer extending from a first conductive surface to a second conductive surface in a first direction and from a first lead outer edge of the first lead to a second lead outer edge of the second lead in a second direction;
• an insulation structure applied to the first conductive surface of the conductive layer and extending continuously from the first lead outer edge to the second lead outer edge, wherein the insulation structure includes an adhesive layer and an insulation layer separated from the conductive layer by the adhesive layer;
• a die affixed to the adhesive layer in the gap;
• bond wires between the die and the first lead and the second lead;
• a mold compound including a first mold section encapsulating the bond wires, the first lead, the second lead, the die, and the insulation structure, and a second mold section formed on the insulation layer of the insulation structure;
• a substrate having a first terminal and a second terminal;
• and
• a solder layer having a first solder portion over the first terminal and a second solder portion over the second terminal, wherein the first lead is affixed to the first terminal at the first solder portion and the second lead is affixed to the second terminal at the second solder portion.

A method for forming an integrated circuit (IC) device, the method comprising:

• providing a conductive layer having a first conductive surface and a second conductive surface;
• applying an insulation structure to the first conductive surface of the conductive layer, wherein the insulation structure includes an adhesive layer and an insulation layer separated from the conductive layer by the adhesive layer in a first direction;
• patterning the conductive layer to form a first lead and a second lead separated by a gap exposing the adhesive layer;
• affixing a die to the adhesive layer in the gap;
• attaching bond wires between the die and the first lead and the second lead;
• and
• encapsulating the bond wires, the first lead, the second lead, the die, and the insulation structure in a first mold section of a mold compound.