Interdigital capacitor
AssigneeTexas Instruments Incorporated
InventorsYiqi Tang, Rajen Manicon Murugan
Life of this patent
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Abstract
A routable lead frame (RLF) substrate has a conductive layer having first- and second-side traces having first fingers and second fingers, respectively, which are interdigitated with each other. A via layer is over the conductive layer. A first-side conductive via of the via layer is conductively coupled to the first-side trace. A second-side conductive via of the via layer is conductively coupled to the second-side trace. Dielectric molding material is disposed between the interdigitated fingers of the conductive layer and between the first-side conductive via and the second-side conductive via. The fingers and vias form an interdigital capacitor (IDC) useful in impedance matching and filtering.
Claims15
A substrate, comprising:
- a conductive layer having a first trace comprising first fingers and a second trace comprising second fingers, the first fingers interdigitated with the second fingers;
- a via layer over the conductive layer, the via layer comprising a first conductive via conductively coupled to the first trace and a second conductive via conductively coupled to the second trace;
- dielectric material disposed between the first trace and the second trace and between the first conductive via and the second conductive via;
- and
- a first terminal conductively coupled to the first trace,
- wherein the first conductive via comprises a comb shape and the first terminal does not comprise a comb shape.
An integrated circuit (IC), comprising:
- a substrate;
- an IC die attached and conductively coupled to an upper surface of the substrate;
- and
- a mold encapsulating the IC die and the upper surface of the substrate, wherein the substrate comprises:
- a conductive layer having a first trace comprising first fingers and a second trace comprising second fingers, the first fingers interdigitated with the second fingers;
- a via layer over the conductive layer, the via layer comprising a first conductive via conductively coupled to the first trace and a second conductive via conductively coupled to the second trace;
- dielectric material disposed between the first trace and the second trace and between the first conductive via and the second conductive via;
- and
- a first terminal conductively coupled to the first trace,
- wherein the first conductive via comprises a comb shape and the first terminal does not comprise a comb shape.
Dependencies are inferred from the claim text.