Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorTaisuke Fukuda
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: a first semiconductor chip and a second semiconductor chip each including a first main electrode on a bottom surface side and a second main electrode on a top surface side; a conductive member provided to electrically connect the first main electrode of the first semiconductor chip to the second main electrode of the second semiconductor chip; a first external terminal electrically connected to the second main electrode of the first semiconductor chip and partly opposed to the conductive member, and a resin member provided to be at least partly arranged between the conductive member and the first external terminal.
Claims15
A semiconductor device comprising:
- a first semiconductor chip and a second semiconductor chip each including a first main electrode on a bottom surface side and a second main electrode on a top surface side;
- a conductive member provided to electrically connect the first main electrode of the first semiconductor chip to the second main electrode of the second semiconductor chip;
- a first external terminal electrically connected to the second main electrode of the first semiconductor chip and the first external terminal partly overlapping the conductive member in a direction perpendicular to the top surface side of the second semiconductor chip;
- and
- an insulating resin member provided to be at least partly arranged in an overlapping region between the conductive member and the first external terminal above the top surface side of the second semiconductor chip,
- wherein the first external terminal, the insulating resin member, and the conductive member are configured with an opening penetrating through the first external terminal, the insulating resin member, and the conductive member, to expose at least a portion of the top surface side of the second semiconductor chip.
Dependencies are inferred from the claim text.