H10W 70/479
On or in insulating or insulated package substrates, interposers, or redistribution layers
Official title: {on or in insulating or insulated package substrates, interposers, or redistribution layers}
H10W70/479 (On or in insulating or insulated package substrates, interposers, or redistribution layers) appears on 1,487 US grants and 1,598 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,487
- Published applications
- 1,598
- Assignees
- 488
- Inventors
- 2,809
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 8 | 0 |
| 1991 | 11 | 0 |
| 1992 | 15 | 0 |
| 1993 | 16 | 0 |
| 1994 | 18 | 0 |
| 1995 | 14 | 0 |
| 1996 | 17 | 0 |
| 1997 | 17 | 0 |
| 1998 | 21 | 0 |
| 1999 | 13 | 0 |
| 2000 | 11 | 0 |
| 2001 | 16 | 13 |
| 2002 | 29 | 21 |
| 2003 | 19 | 30 |
| 2004 | 31 | 30 |
| 2005 | 25 | 39 |
| 2006 | 27 | 43 |
| 2007 | 29 | 33 |
| 2008 | 12 | 41 |
| 2009 | 28 | 54 |
| 2010 | 42 | 38 |
| 2011 | 36 | 43 |
| 2012 | 34 | 46 |
| 2013 | 50 | 40 |
| 2014 | 33 | 71 |
| 2015 | 66 | 72 |
| 2016 | 70 | 108 |
| 2017 | 106 | 84 |
| 2018 | 88 | 74 |
| 2019 | 67 | 83 |
| 2020 | 70 | 113 |
| 2021 | 85 | 117 |
| 2022 | 77 | 102 |
| 2023 | 73 | 97 |
| 2024 | 81 | 96 |
| 2025 | 61 | 63 |
| 2026 | 46 | 47 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power module22 Sep 2026US 12,745,656 B2
- Inductor packages employing wire bonds over a lead frame to form integrated inductor(s), and related integrated circuit (IC) packages and fabrication methods15 Sep 2026US 12,738,411 B2QUALCOMM Incorporated
- Power module15 Sep 2026US 12,740,492 B2Hyundai Motor Company
- Semiconductor apparatus and semiconductor apparatus manufacturing method1 Sep 2026US 12,727,524 B2Fuji Electric Co., Ltd.
- Semiconductor device having a plurality of circuit patterns on a resin insulating layer25 Aug 2026US 12,721,164 B2Mitsubishi Electric Corporation
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Packages with plated die pads, terminals, and inductors1 Oct 2026US 2026/0305386 A1
- Power module package with molded via and dual side press-fit pin1 Oct 2026US 2026/0305495 A1Semiconductor Components Industries, LLC
- Stacked power modules and method of manufacturing17 Sep 2026US 2026/0282504 A1General Electric Company
- Molded package with press-fit conductive pins17 Sep 2026US 2026/0282975 A1
Most cited
By later US patents
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies, methods of making same and components for same424US 5,679,977 ATessera, Inc. · 1997
- Leadless image sensor package structure and method for making the same353US 6,384,472 B1Siliconware Precision Industries Co., Ltd. · 2002
- Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof266US 8,420,447 B2STATS ChipPAC, Ltd. · 2013