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US 2026/0305495 A1Published application
Power module package with molded via and dual side press-fit pin
AssigneeSemiconductor Components Industries, LLC
InventorsHeejo CHI, Seungwon IM, Oseob JEON
Life of this patent
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Abstract
A module includes an assembly of a semiconductor device die, a lead frame connected to the semiconductor device die, and a substrate connected to the lead frame. The substrate includes at least one plated-through hole (PTH). A mold body encapsulates the assembly. The mold body includes a through-mold via (TMV) aligned with a portion of the substrate including the at least one PTH. The PTH is exposed in the TMV to an environment outside the mold body and is physically accessible from outside the mold body through the TMV.
Claims20
A module comprising:
- an assembly including a substrate coupled to a lead frame, the substrate including a plated through-hole;
- and
- a mold body encapsulating the assembly, the mold body including a through-mold via, the plated through-hole and a portion of the lead frame being exposed in the through-mold via to an environment outside the mold body.
A module comprising:
- a semiconductor device encapsulated in a mold body;
- a lead frame electrically coupled to the semiconductor device;
- and
- a press-fit pin coupler disposed outside the mold body in a through-mold via, the press-fit pin coupler being physically accessible from outside the mold body through the through-mold via, the press-fit pin coupler being electrically connected to the semiconductor device encapsulated in the mold body.
1 more element
A method comprising:
- forming an assembly including a substrate coupled to a lead frame, the substrate including a plated through-hole;
- and
- partially encapsulating the assembly in a mold body, the mold body including a through-mold via, the plated through-hole and a portion of the lead frame being exposed in the through-mold via to an environment outside the mold body.
Dependencies are inferred from the claim text.