Semiconductor apparatus and semiconductor apparatus manufacturing method

A method of manufacturing a semiconductor apparatus, comprising:

• preparing a semiconductor product that includes
• a semiconductor element with a top electrode,
• a control terminal, including a pad that is to be electrically connected to the top electrode of the semiconductor element through a wiring member, and
• a case member in which at least a portion of the control terminal is embedded and which defines a space for housing the semiconductor element, the case member including a wiring member positioning part raised on the case member as a reference point for positioning of the wiring member to be connected to the pad,
• an encapsulating resin filling the space, and
• a coating film interposed between the positioning part and the encapsulating resin, wherein
• the pad is provided in plurality as a pad group and the plurality of pads in the pad group is arranged in a predetermined direction,
• the positioning part is provided in plurality and two positioning parts among the plurality of positioning parts sandwich therebetween the pad group in the predetermined direction,
• one of the two positioning parts is disposed beside an outmost one of the plurality of pads at one of opposite ends of the pad group in the predetermined direction, and
• the other of the two positioning parts is disposed beside another outmost one of the plurality of pads at the other of the opposite ends of the pad group;
• producing a planar image of the area around the pad;
• and
• connecting the wiring member to one of the plurality of pads on a basis of relative coordinates between one of the plurality of positioning parts and the one of the plurality of pads in the planar image.