Semiconductor chip assemblies, methods of making same and components for same

A component for use in semiconductor chip assemblies, the component including a sheetlike interposer having outboard edges, a plurality of terminals disposed on said interposer and a plurality of prefabricated leads connected to said terminals and having contact portions adjacent said outboard edges, said prefabricated leads extending outwardly from said terminals to said contact portions, said prefabricated leads being flexible, the contact portion of each said prefabricated lead being movable with respect to the terminal connected to such lead.

A module comprising:

• a substrate having a top surface, contact pads on the top surface, external connections and conductors interconnecting the contact pads with one another and with said external connections in a preselected pattern of interconnection;
• a plurality of semiconductor chips, each having a plurality of surfaces and having contacts on at least one of such surfaces;
• a flexible sheetlike element having terminals thereon associated with each said chip, the terminals of each said sheetlike element being electrically connected to the contacts of the associated chip, the sheetlike element and at least some of the terminals thereon overlying one said surface of the associated chip, the terminals being moveable with respect to the chip to compensate for thermal expansion, each said sheetlike element including a compliant layer disposed between the terminals and the associated chip, said terminals being connected to said contact pads on said substrate.

A semiconductor chip assembly comprising a semiconductor chip having a front surface and having contacts on said front surface and a flexible sheetlike element having terminals thereon, and flexible leads electrically connecting said terminals to said contacts, wherein said sheetlike element and at least some of said terminals overlie said front surface of said chip, said terminals are movable with respect to said chip, said flexible leads and said flexible sheetlike element being adapted to deform to accommodate movement of said terminals with respect to said contacts, said sheetlike element including a layer of a compliant material disposed between said terminals and said chip front surface.

A semiconductor chip assembly comprising a semiconductor chip having a front surface and having contacts on said front surface, a support structure juxtaposed with said chip and having a top surface disposed alongside said front surface of said chip and a flexible sheetlike element having terminals thereon, and flexible leads electrically connecting said terminals to said contacts, wherein at least a part of said shootlike element and at least some of said terminals overlie said support structure, said terminals are movable with respect to said chip, said flexible leads and said flexible sheetlike element being adapted to deform to accommodate movement of said terminals with respect to said contacts, said sheetlike element including a layer of a compliant material disposed between said terminals and said top surface of said support structure.