Inductor packages employing wire bonds over a lead frame to form integrated inductor(s), and related integrated circuit (IC) packages and fabrication methods

A method of fabricating an inductor package, comprising:

• providing a lead frame, wherein the lead frame comprises:
• a metal frame structure comprising:
• a plurality of leads each comprising a tail portion extending in a second direction,
• each lead of the plurality of leads adjacent to another lead of the plurality of leads;
• and
• a plurality of second leads each comprising a second tail portion extending in the second direction,
• each second lead of the plurality of second leads adjacent to another second lead of the plurality of second leads;
• and
• a plurality of third leads between the plurality of leads and the plurality of second leads in the second direction,
• each third lead of the plurality of third leads comprising third tail portion extending at least partially in a first direction orthogonal to the second direction;
• and
• each third lead of the plurality of third leads adjacent to another third lead of the plurality of third leads;
• and
• forming a conductive coil, comprising:
• coupling each wire bond of one or more wire bonds to at least two (2) leads of the plurality of leads to form a first inductor;
• forming a second conductive coil, comprising:
• coupling each second wire bond of one or more second wire bonds to at least two (2) second leads of the plurality of second leads to form a second inductor;
• and
• forming a third conductive coil between the inductor and the second inductor in the second direction, comprising:
• coupling each third wire bond of one or more second third bonds to at least two (2) third leads of the plurality of third leads to form a third inductor.

An integrated circuit (IC) package, comprising:

• a package substrate comprising a first surface and one or more first metallization layers each comprising one or more first metal interconnects;
• a die coupled to the first surface of the package substrate, the die coupled to at least one first metal interconnect of the one or more metal interconnects;
• and
• a power management die coupled to the package substrate, the power management die coupled to the at least one first metal interconnect coupled to the die and coupled to at least one second metal interconnect of the one or more metal interconnects;
• and
• an inductor package coupled to the package substrate and coupled to the at least one second metal interconnect coupled to the power management die, the inductor package comprising:
• a lead frame, comprising:
• a metal frame structure comprising:
• a plurality of leads each comprising a tail portion extending in a second direction,
• each lead of the plurality of leads adjacent to another lead of the plurality of leads;
• a plurality of second leads each comprising a second tail portion extending in the second direction,
• each second lead of the plurality of second leads adjacent to another second lead of the plurality of second leads;
• and
• a plurality of third leads between the plurality of leads and the plurality of second leads in the second direction,
• each third lead of the plurality of third leads comprising third tail portion extending at least partially in a first direction orthogonal to the second direction;
• and
• each third lead of the plurality of third leads adjacent to another third lead of the plurality of third leads;
• and
• an inductor comprising a conductive coil, comprising:
• the plurality of leads;
• and
• one or more wire bonds each coupled to at least two (2) leads of the plurality of leads;
• a second inductor comprising a second conductive coil, comprising:
• the plurality of second leads;
• and
• one or more second wire bonds each coupled to at least two (2) second leads of the plurality of second leads;
• a third inductor comprising a third conductive coil between the inductor and the second inductor in the second direction, comprising:
• the plurality of third leads;
• and
• one or more third wire bonds each coupled to at least two (2) third leads of the plurality of third leads.