H10W 70/476
Oscillators in combination with leadframes
Official title: {Oscillators in combination with leadframes}
H10W70/476 (Oscillators in combination with leadframes) appears on 33 US grants and 26 published applications in this corpus.
Search patents in H10W- Granted patents
- 33
- Published applications
- 26
- Assignees
- 13
- Inventors
- 39
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 2 |
| 2014 | 1 | 0 |
| 2015 | 1 | 3 |
| 2016 | 2 | 2 |
| 2017 | 2 | 1 |
| 2018 | 0 | 4 |
| 2019 | 3 | 4 |
| 2020 | 8 | 3 |
| 2021 | 1 | 1 |
| 2022 | 2 | 1 |
| 2023 | 1 | 1 |
| 2024 | 0 | 1 |
| 2025 | 1 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device and measurement device26 Dec 2023US 11,854,952 B2Lapis Semiconductor Co., Ltd.
- Stacked-die bulk acoustic wave oscillator package12 Jul 2022US 11,387,782 B2Texas Instruments Incorporated
- Semiconductor device having an oscillator and an associated integrated circuit19 Apr 2022US 11,309,234 B2Lapis Semiconductor Co., Ltd.
- Semiconductor power module, motor controller, and vehicle5 Jun 2025US 2025/0183134 A1BYD Company Limited
- Semiconductor device and measurement device28 Mar 2024US 2024/0105565 A1Lapis Semiconductor Co., Ltd.
- Inertial measurement unit27 Apr 2023US 2023/0125187 A1Seiko Epson Corporation
- Semiconductor device and measurement device14 Jul 2022US 2022/0223505 A1Lapis Semiconductor Co., Ltd.
- Stacked-Die Bulk Acoustic Wave Oscillator Package29 Apr 2021US 2021/0126585 A1Texas Instruments Incorporated
Most cited
By later US patents
- Method of encapsulating a crystal oscillator54US 5,577,319 AMotorola, Inc. · 1996
- PLL oscillator package and production method thereof42US 6,081,164 ASeiko Epson Corporation · 2000
- Piezoelectric oscillator formed in resin package containing, IC chip and piezoelectric oscillator element28US 5,327,104 ASeiko Epson Corporation · 1994
- Surface mountable clock oscillator module26US 5,229,640 AAVX Corporation · 1993
- Package for piezo-oscillator16US 4,916,413 AMatsushima Kogyo Kabushiki Kaisha · 1990