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AssigneeSeiko Epson Corporation
InventorMasayuki Kikushima
Estimating the term…
A flat package piezoelectric oscillator, sealed with resin, and having leads or terminals includes an IC chip mounted on one side of an island portion of a lead frame, and a piezoelectric oscillator element mounted on an opposite side of the island portion. The resin package of the oscillator has at least one hole through one of opposite surfaces of the package. An injection hole for resin injection is provided along a diagonal line extending between diametrically opposed corners of the resin package, and a cylindrical case of the piezoelectric crystal oscillator element is located such that its longitudinal axis is aligned with the diagonal line to within a range from -45.degree. to +45.degree.. The connection portions of lead terminals for the piezoelectric oscillator element and the pads of the IC chip are located adjacent to the diagonal line. The fabrication of the piezoelectric crystal oscillator is completed by sealing the above described structure with resin.
A piezoelectric oscillator comprising at least one IC chip mounted on one surface of a lead frame, and at least one piezoelectric oscillator element mounted on an opposite surface of the lead frame, a body of said piezoelectric oscillator being molded from resin to form a rectangular resin package surrounding said at least one IC chip and said at least one piezoelectric oscillator element, said piezoelectric oscillator element having a longitudinal axis arranged to extend within a range from -45.degree. to +45.degree. of a diagonal line extending between two diametrically opposed corners of said rectangular resin package.
A piezoelectric oscillator comprising:
A piezoelectric oscillator comprising:
A piezoelectric oscillator comprising at least one IC chip mounted on one side of a lead frame, and at least one piezoelectric oscillator element mounted on an opposite side of the lead frame, a body of said piezoelectric oscillator being molded from resin to form a resin package surrounding said at least one IC chip and said at least one piezoelectric oscillator element, said resin package having at least one through hole extending between one of opposite surfaces of the resin package and a surface of said at least one piezoelectric oscillator element so that an internal cavity of the resin package containing said at least one piezoelectric oscillator element is vented.
A piezoelectric oscillator comprising at least one IC chip mounted on one side of a lead frame, and at least one piezoelectric oscillator element mounted on an opposite side of the lead frame, a body of said piezoelectric oscillator being molded from resin to form a resin package surrounding said at lead one IC chip and said at least one piezoelectric oscillator element, said resin package having four corners and an injection hole for injecting resin provided on one of the four corners of the resin package along a diagonal line extending between two diametrically opposed corners of the resin package, and a longitudinal axis of the at least one piezoelectric oscillator element arranged to extend to within a range from -45.degree. to +45.degree. of said diagonal line.
A piezoelectric oscillator comprising at least one IC chip mounted on one side of a lead frame, and at least one piezoelectric oscillator element mounted on an opposite side of the lead frame, a body of said piezoelectric oscillator being molded from resin to form a resin package surrounding said at least one IC chip and said at least one piezoelectric oscillator element, said at least one IC chip mounted on one side of an island portion of the lead frame, said at least one piezoelectric oscillator element mounted on an opposite side of the island portion of the lead frame, said island portion being recessed toward the piezoelectric oscillator element to form a depression in which said IC chip is located.
Dependencies are inferred from the claim text.