Stacked-die bulk acoustic wave oscillator package
AssigneeTexas Instruments Incorporated
InventorsRicky A. Jackson, Kurt Peter Wachtler
Life of this patent
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Abstract
A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.
Claims24
A stacked-die oscillator package, comprising:
- an oscillator circuit die having a first and a second bond pad;
- a bulk acoustic wave (BAW) resonator die flip chip bonded to the first and second bond pads of the oscillator circuit die;
- and
- a polymer material positioned in a portion of a gap between the BAW resonator die and the oscillator circuit die.
A method of assembling a stacked-die oscillator package, comprising:
- providing (i) an oscillator circuit die having bond pads comprising a first and a second bond pad, and (ii) a bulk acoustic wave (BAW) resonator;
- forming a polymer material on a surface of the oscillator circuit die or on a surface of the BAW resonator die in at least a first polymer material region;
- flip chip bonding the BAW resonator die to the oscillator circuit die so that the first polymer material region is between the BAW resonator die and the oscillator circuit die.
Dependencies are inferred from the claim text.