Semiconductor power module, motor controller, and vehicle

A motor controller, comprising:

• a heat dissipation bottom plate;
• a coolant channel mounted in the coolant channel;
• and
• a semiconductor power device disposed on the heat dissipation bottom plate, and comprising:
• a substrate comprising a first direction and a second direction orthogonal to each other;
• a first conductive region comprising a first transverse section and a second transverse section;
• a second conductive region, the second conductive region and the first conductive region spaced apart on the substrate;
• the second conductive region comprising a third transverse section and a fourth transverse section;
• and the first transverse section, the third transverse section, the second transverse section, and the fourth transverse section disposed in the first direction, wherein the first conductive region and the second conductive region are configured to transmit DC signals;
• at least one first power chip connected to the first transverse section and the third transverse section;
• and
• at least one second power chip connected to the second transverse section and the fourth transverse section.

A vehicle, comprising:

• a motor;
• and
• a motor controller connected to the motor, and comprising:
• a heat dissipation bottom plate;
• a coolant channel mounted in the coolant channel;
• and
• a semiconductor power device disposed on the heat dissipation bottom plate, and comprising:
• a substrate comprising a first direction and a second direction orthogonal to each other;
• a first conductive region comprising a first transverse section and a second transverse section;
• a second conductive region, the second conductive region and the first conductive region spaced apart on the substrate;
• the second conductive region comprising a third transverse section and a fourth transverse section;
• and the first transverse section, the third transverse section, the second transverse section, and the fourth transverse section disposed in the first direction, wherein the first conductive region and the second conductive region are configured to transmit DC signals;
• at least one first power chip connected to the first transverse section and the third transverse section;
• and
• at least one second power chip connected to the second transverse section and the fourth transverse section.